Austin, Texas
United States
12
2015-11-26
The entities that hold a legal rights for patent applications filed by inventor McLellan Neil:
Neil McLellan from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods of fabricating semiconductor chip solder structures
#2 | 2015-02-19Circuit board with corner hollows
#3 | 2013-12-26SEMICONDUCTOR SUBSTRATE WITH ONBOARD TEST STRUCTURE
#4 | 2013-10-03SEMICONDUCTOR CHIP DEVICE WITH VENTED LID
#5 | 2013-10-03DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS
#6 | 2013-10-03STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
#7 | 2013-10-03Thermal management of stacked semiconductor chips with electrically non-functional interconnects
#8 | 2013-10-03SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS
#9 | 2013-06-20Semiconductor chip with underfill anchors
#10 | 2013-05-09SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER
#11 | 2013-02-28Methods of fabricating semiconductor chip solder structures
#12 | 2011-06-09Conductor bump method and apparatus
108407 ⎘