Ichon-si
South Korea
34
2013-03-28
The entities that hold a legal rights for patent applications filed by inventor Chi HeeJo:
HeeJo Chi from Ichon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Integrated circuit packaging system with encapsulation and method of manufacture thereof
#2 | 2013-03-28INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
#3 | 2013-03-07Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
#4 | 2013-03-07Integrated circuit packaging system with stiffener and method of manufacture thereof
#5 | 2013-02-28Integrated circuit packaging system with redistribution layer and method of manufacture thereof
#6 | 2012-12-27INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
#7 | 2012-12-20INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF
#8 | 2012-12-20Integrated circuit packaging system with laser hole and method of manufacture thereof
#9 | 2012-12-20Integrated circuit packaging system with intra substrate die and method of manufacture thereof
#10 | 2012-12-06Integrated circuit packaging system with package stacking and method of manufacture thereof
#11 | 2012-09-27Integrated circuit packaging system with an interposer substrate and method of manufacture thereof
#12 | 2012-09-13INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHOD OF MANUFACTURE THEREOF
#13 | 2012-05-17Integrated circuit packaging system with foldable substrate and method of manufacture thereof
#14 | 2012-03-22Integrated circuit packaging system with post and method of manufacture thereof
#15 | 2012-02-02Integrated circuit packaging system with package-on-package and method of manufacture thereof
#16 | 2011-12-22Integrated circuit system with recessed through silicon via pads and method of manufacture thereof
#17 | 2011-12-08Integrated circuit package system with package stacking and method of manufacture thereof
#18 | 2011-12-01Integrated circuit package system with embedded die superstructure and method of manufacture thereof
#19 | 2011-11-24Integrated circuit packaging system with dual side connection and method of manufacture thereof
#20 | 2011-09-15Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects
#21 | 2011-09-15Carrier system with multi-tier conductive posts and method of manufacture thereof
#22 | 2011-09-08INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
#23 | 2011-09-08Integrated circuit package stacking system with shielding and method of manufacture thereof
#24 | 2011-08-25Integrated circuit packaging system with shield and method of manufacture thereof
#25 | 2011-06-16Integrated circuit packaging system with stacking interconnect and method of manufacture thereof
#26 | 2011-04-19Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof
#27 | 2011-03-24Integrated circuit packaging system with package-on-package and method of manufacture thereof
#28 | 2011-03-24Integrated circuit packaging system with encapsulated via and method of manufacture thereof
#29 | 2011-03-17Integrated circuit packaging system with package-on-package and method of manufacture thereof
#30 | 2011-02-03Integrated circuit packaging system with through silicon via base and method of manufacture thereof
#31 | 2011-01-04Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof
#32 | 2010-12-16Integrated circuit packaging system with a stack package and method of manufacture thereof
#33 | 2010-12-16Integrated circuit packaging system with package-on-package and method of manufacture thereof
#34 | 2010-09-30INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF
108444 ⎘