Munich
Germany
6
2023-07-27
The entities that hold a legal rights for patent applications filed by inventor Chen Liu:
Liu Chen from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
#2 | 2016-12-29Semiconductor package with integrated magnetic field sensor
#3 | 2016-12-29Power package with integrated magnetic field sensor
#4 | 2016-12-29Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto
#5 | 2016-02-18Module with integrated power electronic circuitry and logic circuitry
#6 | 2015-03-05Overmolded substrate-chip arrangement with heat sink
1085756 ⎘