Jun HE

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2016-12-22

Top Assignees for applications by Jun HE

The entities that hold a legal rights for patent applications filed by inventor HE Jun:

Jun HE from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Interconnects having sealing structures to enable selective metal capping layers

Debond interconnect structures

Interconnects having sealing structures to enable selective metal capping layers

Debond interconnect structures

InventorID:

1122279 ⎘