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Inventor profile of:

Tomotaka Tabuchi

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-02-22

Top Assignees for applications by Tomotaka Tabuchi

The entities that hold a legal rights for patent applications filed by inventor Tabuchi Tomotaka:

DISCO CORPORATION 11 Tokyo, Japan

Recent patent applications by Tabuchi Tomotaka

Tomotaka Tabuchi from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-02-22

US20240058918A1

Performing operations; transporting

CHUCK TABLE MANUFACTURING METHOD

#2 | 2021-02-25

US20210057225A1

Electricity

Wafer processing method

#3 | 2020-12-17

US20200391337A1

Performing operations; transporting

Grinding apparatus and use method of grinding apparatus

#4 | 2018-11-15

US20180330957A1

Electricity

WORKPIECE PROCESSING METHOD

#5 | 2018-10-25

US20180308755A1

Electricity

Device chip manufacturing method

#6 | 2018-06-14

US20180166282A1

Electricity

Wafer processing method for reforming protective film

#7 | 2017-05-18

US20170140989A1

Electricity

Wafer dividing method

#8 | 2016-02-11

US20160042996A1

Electricity

Wafer processing method

#9 | 2016-02-11

US20160042962A1

Electricity

Processing method for workpiece

#10 | 2015-05-28

US20150147870A1

Electricity

Wafer processing utilizing a frame with a plurality of partitions

#11 | 2015-05-21

US20150140784A1

Electricity

Resin powder wafer processing utilizing a frame with a plurality of partitions

#12 | 2005-02-08

US10250916

Production method for semiconductor chip

InventorID:

1168557 ⎘