DISCO CORPORATION

WAFER GRINDING APPARATUS AND WAFER GRINDING METHOD

#2 | 2026-02-19

US20260048463A1

TAPE MOUNTER, PROCESSING APPARATUS, AND METHOD FOR PROCESSING WORKPIECES

#3 | 2025-12-18

US20250385138A1

METHOD FOR MANUFACTURING CHIPS

#4 | 2025-12-11

US20250377241A1

LASER INTENSITY MEASURING DEVICE, LASER PROCESSING APPARATUS HAVING THE LASER INTENSITY MEASURING DEVICE, METHOD FOR MEASURING LASER INTENSITY, AND METHOD FOR LASER PROCESSING

#5 | 2025-12-04

US20250372457A1

METHOD FOR PROCESSING A WAFER AND METHOD FOR MANUFACTURING DEVICE CHIPS

#6 | 2025-11-27

US20250364331A1

METHOD FOR PROCESSING A WAFER AND METHOD FOR MANUFACTURING CHIPS

#7 | 2025-11-27

US20250364240A1

METHOD FOR PROCESSING WORKPIECES, PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING A WAFER

#8 | 2025-11-20

US20250357156A1

METHOD FOR REUSING A SUPPORTING WAFER AND METHOD FOR MANUFACTURING CHIPS

#9 | 2025-10-30

US20250336684A1

METHOD FOR MANUFACTURING PACKAGED DEVICE CHIPS

#10 | 2025-10-23

US20250329540A1

METHOD FOR PROCESSING WAFER AND PROCESSING APPARATUS

#11 | 2025-10-02

US20250303434A1

PROTECTIVE MEMBER FORMING APPARATUS AND METHOD FOR FORMING A PROTECTIVE MEMBER

#12 | 2025-09-25

US20250296189A1

METHOD FOR GRINDING PLATE-FORMED WORKPIECE AND GRINDING APPARATUS

#13 | 2025-08-28

US20250269492A1

METHOD FOR FORMING A HOLDER SURFACE, AND GRINDING APPARATUS

#14 | 2025-08-28

US20250269408A1

CLEANING APPARATUS AND CLEANING METHOD

#15 | 2025-08-07

US20250249614A1

CHUCK TABLE AND HALF-CUTTING METHOD

#16 | 2025-08-07

US20250249546A1

POLISHING APPARATUS, AND METHOD FOR POLISHING SiC WAFERS

#17 | 2025-07-31

US20250246457A1

PEELING APPARATUS AND PEELING METHOD

#18 | 2025-07-31

US20250242389A1

CLEANING APPARATUS, PROCESSING SYSTEM, AND CLEANING METHOD

#19 | 2025-05-08

US20250149356A1

PROTECTIVE MEMBER FORMING APPARATUS

#20 | 2025-04-10

US20250114893A1

EDGE TRIMMING METHOD AND EDGE TRIMMING APPARATUS

#21 | 2025-03-13 ✅ Patent 12,643,184 granted on 2026-06-02

US20250083269A1

WORKPIECE SUPPORT

#22 | 2025-01-30 ✅ Patent 12,643,263 granted on 2026-06-02

US20250033245A1

BETA GALLIUM OXIDE SUBSTRATE MANUFACTURING METHOD

#23 | 2025-01-16

US20250018528A1

PROCESSING METHOD FOR WORKPIECE

#24 | 2025-01-09 ✅ Patent 12,639,186 granted on 2026-05-26

US20250013548A1

INFORMATION TRANSMISSION METHOD

#25 | 2024-11-28 ✅ Patent 12,374,535 granted on 2025-07-29

US20240395512A1

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

#26 | 2024-09-26 ✅ Patent 12,515,373 granted on 2026-01-06

US20240316823A1

WORKPIECE PROCESSING METHOD

#27 | 2024-09-26 ✅ Patent 12,617,050 granted on 2026-05-05

US20240316707A1

PROCESSING MACHINE AND UNLOADING METHOD OF WORKPIECE

#28 | 2024-08-01 ✅ Patent 12,412,788 granted on 2025-09-09

US20240258179A1

PROCESSING METHOD

#29 | 2024-08-01 ✅ Patent 12,635,471 granted on 2026-05-19

US20240258149A1

METHOD OF LAYING PROTECTIVE SHEET AND PROTECTIVE SHEET

#30 | 2024-08-01

US20240254368A1

Chemistry; metallurgy

ADHESIVE SHEET FOR REAR SURFACE GRINDING, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND BASE MATERIAL SHEET

#31 | 2024-08-01 ✅ Patent 12,629,782 granted on 2026-05-19

US20240253164A1

WAFER PROCESSING METHOD

#32 | 2024-07-18

US20240243000A1

ADHESIVE SHEET FOR BACKGRINDING, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SUBSTRATE SHEET

#33 | 2024-06-20 ✅ Patent 12,523,865 granted on 2026-01-13

US20240201481A1

OPTICAL PART ASSEMBLY

#34 | 2024-06-13 ✅ Patent 12,479,048 granted on 2025-11-25

US20240194501A1

WAFER PROCESSING APPARATUS

#35 | 2024-06-06 ✅ Patent 12,365,162 granted on 2025-07-22

US20240181746A1

RESIN SHEET

#36 | 2024-05-23 ✅ Patent 12,459,147 granted on 2025-11-04

US20240165842A1

CUTTING APPARATUS

#37 | 2024-05-16 ✅ Patent 12,589,457 granted on 2026-03-31

US20240157493A1

SPINDLE UNIT AND PROCESSING APPARATUS

#38 | 2024-05-09 ✅ Patent 12,538,763 granted on 2026-01-27

US20240153776A1

BONDED WAFER PROCESSING METHOD

#39 | 2024-05-02 ✅ Patent 12,604,693 granted on 2026-04-14

US20240145307A1

METHOD OF MANUFACTURING CHIPS

#40 | 2024-05-02 ✅ Patent 12,343,812 granted on 2025-07-01

US20240139864A1

LASER PROCESSING APPARATUS

#41 | 2024-05-02 ✅ Patent 12,337,412 granted on 2025-06-24

US20240139863A1

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

#42 | 2024-04-25 ✅ Patent 12,411,600 granted on 2025-09-09

US20240134518A1

TOUCH PANEL

#43 | 2024-04-25 ✅ Patent 12,533,751 granted on 2026-01-27

US20240131629A1

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

#44 | 2024-04-18 ✅ Patent 12,635,437 granted on 2026-05-19

US20240128086A1

METHOD OF PROCESSING WAFER

#45 | 2024-04-18 ✅ Patent 12,576,480 granted on 2026-03-17

US20240123575A1

DRESSING BOARD AND SHAPE DETERMINING METHOD

#46 | 2024-04-11 ✅ Patent 12,593,642 granted on 2026-03-31

US20240120215A1

METHOD OF PROCESSING WAFER AND WAFER PROCESSING APPARATUS

#47 | 2024-04-04 ✅ Patent 12,532,715 granted on 2026-01-20

US20240112902A1

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

#48 | 2024-03-28 ✅ Patent 12,527,067 granted on 2026-01-13

US20240105513A1

WAFER PROCESSING METHOD AND DEVICE CHIP MANUFACTURING METHOD

#49 | 2024-03-28 ✅ Patent 12,652,978 granted on 2026-06-09

US20240105458A1

DEVICE WAFER PROCESSING METHOD

#50 | 2024-03-28 ✅ Patent 12,598,936 granted on 2026-04-07

US20240100632A1

CHIP MANUFACTURING METHOD

#51 | 2024-03-21 ✅ Patent 12,560,557 granted on 2026-02-24

US20240094143A1

INSPECTION METHOD OF WORKPIECE AND INSPECTION APPARATUS

#52 | 2024-03-14 ✅ Patent 12,538,762 granted on 2026-01-27

US20240087901A1

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

#53 | 2024-03-14 ✅ Patent 12,551,973 granted on 2026-02-17

US20240082960A1

WAFER PROCESSING METHOD

#54 | 2024-03-07 ✅ Patent 12,581,885 granted on 2026-03-17

US20240079243A1

PROCESSING METHOD OF WAFER

#55 | 2024-02-29 ✅ Patent 12,581,889 granted on 2026-03-17

US20240071827A1

DIVIDING METHOD OF WAFER

#56 | 2024-02-29 ✅ Patent 12,512,314 granted on 2025-12-30

US20240071753A1

PROCESSING METHOD OF WAFER

#57 | 2024-02-29 ✅ Patent 12,654,279 granted on 2026-06-16

US20240066659A1

PROCESSING APPARATUS

#58 | 2024-02-22 ✅ Patent 12,605,801 granted on 2026-04-21

US20240058918A1

CHUCK TABLE MANUFACTURING METHOD

#59 | 2024-02-01 ✅ Patent 12,604,714 granted on 2026-04-14

US20240038591A1

LIFT-OFF METHOD

#60 | 2024-02-01 ✅ Patent 12,564,970 granted on 2026-03-03

US20240033942A1

TRANSFER APPARATUS

#61 | 2024-01-11 ✅ Patent 12,594,640 granted on 2026-04-07

US20240009792A1

GRINDING METHOD FOR SLICE WAFER

#62 | 2024-01-04 ✅ Patent 12,610,769 granted on 2026-04-21

US20240006241A1

PROCESSING METHOD

#63 | 2024-01-04 ✅ Patent 12,593,638 granted on 2026-03-31

US20240006239A1

DEVICE WAFER PROCESSING METHOD

#64 | 2024-01-04 ✅ Patent 12,654,259 granted on 2026-06-16

US20240001490A1

DIAMOND SUBSTRATE MANUFACTURING METHOD

#65 | 2023-12-28 ✅ Patent 12,456,608 granted on 2025-10-28

US20230420221A1

METHOD OF PROCESSING WAFER

#66 | 2023-12-21 ✅ Patent 12,272,102 granted on 2025-04-08

US20230410370A1

Positioning method

#67 | 2023-12-21 ✅ Patent 12,578,712 granted on 2026-03-17

US20230409018A1

PROCESSING APPARATUS

#68 | 2023-12-21 ✅ Patent 12,343,821 granted on 2025-07-01

US20230405738A1

PROCESSING EQUIPMENT

#69 | 2023-12-14 ✅ Patent 12,508,674 granted on 2025-12-30

US20230398641A1

DETECTION METHOD OF RESISTIVITY AND PROCESSING METHOD OF PLATE-SHAPED WORKPIECE

#70 | 2023-12-07 ✅ Patent 12,371,297 granted on 2025-07-29

US20230391576A1

TAPE AFFIXING APPARATUS

#71 | 2023-12-07 ✅ Patent 12,424,478 granted on 2025-09-23

US20230390878A1

APPARATUS FOR AND METHOD OF PROCESSING WORKPIECE

#72 | 2023-11-30 ✅ Patent 12,447,560 granted on 2025-10-21

US20230381894A1

MANUFACTURING METHOD OF SINGLE CRYSTAL SILICON SUBSTRATE

#73 | 2023-11-23 ✅ Patent 12,532,685 granted on 2026-01-20

US20230377971A1

METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS

#74 | 2023-11-16 ✅ Patent 12,489,019 granted on 2025-12-02

US20230369117A1

METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS

#75 | 2023-11-16 ✅ Patent 12,459,059 granted on 2025-11-04

US20230364717A1

LASER PROCESSING APPARATUS

#76 | 2023-10-26 ✅ Patent 12,330,251 granted on 2025-06-17

US20230339055A1

HOLDING UNIT

#77 | 2023-10-19 ✅ Patent 12,486,187 granted on 2025-12-02

US20230331614A1

Chemistry; metallurgy

WAFER PRODUCTION SYSTEM AND WAFER MANUFACTURING METHOD

#78 | 2023-10-12 ✅ Patent 12,564,009 granted on 2026-02-24

US20230326782A1

CUTTING APPARATUS

#79 | 2023-10-12 ✅ Patent 12,496,674 granted on 2025-12-16

US20230321781A1

GETTERING LAYER FORMING DEVICE AND PROCESSING APPARATUS

#80 | 2023-10-12 ✅ Patent 12,290,881 granted on 2025-05-06

US20230321761A1

Laser processing method

#81 | 2023-10-05 ✅ Patent 12,474,217 granted on 2025-11-18

US20230314234A1

INSPECTION METHOD

#82 | 2023-09-21 ✅ Patent 12,519,019 granted on 2026-01-06

US20230298940A1

WAFER PROCESSING METHOD

#83 | 2023-09-21 ✅ Patent 12,635,441 granted on 2026-05-19

US20230298938A1

WAFER PROCESSING METHOD

#84 | 2023-09-21 ✅ Patent 12,568,798 granted on 2026-03-03

US20230298925A1

EXPANSION METHOD

#85 | 2023-09-21 ✅ Patent 11,935,738 granted on 2024-03-19

US20230298881A1

Method of processing a wafer

#86 | 2023-09-21 ✅ Patent 12,253,458 granted on 2025-03-18

US20230296498A1

Dryness detection method and dryness detection apparatus

#87 | 2023-09-21 ✅ Patent 12,343,836 granted on 2025-07-01

US20230294230A1

TREATMENT METHOD OF WORKPIECE

#88 | 2023-09-21 ✅ Patent 12,512,333 granted on 2025-12-30

US20230294141A1

CLEANING APPARATUS

#89 | 2023-09-14 ✅ Patent 12,424,456 granted on 2025-09-23

US20230290651A1

METHOD OF MANUFACTURING PACKAGE DEVICE

#90 | 2023-09-07 ✅ Patent 12,518,973 granted on 2026-01-06

US20230282486A1

WAFER PROCESSING METHOD

#91 | 2023-09-07 ✅ Patent 12,270,790 granted on 2025-04-08

US20230280249A1

Inspection apparatus

#92 | 2023-09-07 ✅ Patent 12,454,077 granted on 2025-10-28

US20230278260A1

DIVIDING APPARATUS

#93 | 2023-09-07 ✅ Patent 12,090,563 granted on 2024-09-17

US20230278124A1

Laser reflow method

#94 | 2023-08-31 ✅ Patent 12,447,570 granted on 2025-10-21

US20230271285A1

FLANGE

#95 | 2023-08-24 ✅ Patent 12,604,704 granted on 2026-04-14

US20230268220A1

WAFER TRANSFER METHOD AND WAFER TRANSFER APPARATUS

#96 | 2023-08-24 ✅ Patent 12,384,048 granted on 2025-08-12

US20230264363A1

TRANSFER APPARATUS

#97 | 2023-08-10 ✅ Patent 12,134,138 granted on 2024-11-05

US20230249282A1

Wafer manufacturing method

#98 | 2023-08-03 ✅ Patent 12,635,481 granted on 2026-05-19

US20230245914A1

CHUCK TABLE AND MANUFACTURING METHOD OF CHUCK TABLE

#99 | 2023-08-03 ✅ Patent 12,181,267 granted on 2024-12-31

US20230243639A1

Measuring method

#100 | 2023-07-27

US20230234183A1