Dan Dai

City:

Jiangsu

Country:

China

Published Applications:

Last publication date:

2020-07-09

Top Assignees for applications by Dan Dai

The entities that hold a legal rights for patent applications filed by inventor Dai Dan:

Dan Dai from Jiangsu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR MANUFACTURING DUAL-CAVITY STRUCTURE, AND DUAL-CAVITY STRUCTURE

Manufacturing method of MEMS chip

METHOD FOR FABRICATING MULTI-TRENCH STRUCTURE

MEMS chip and manufacturing method therefor

InventorID:

1180255 ⎘