Suwon-si
South Korea
43
2026-04-16
The entities that hold a legal rights for patent applications filed by inventor LEE Seung-Eun:
Seung-Eun LEE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE
#2 | 2025-04-24PRINTED CIRCUIT BOARD
#3 | 2025-04-17PRINTED CIRCUIT BOARD
#4 | 2025-04-17PRINTED CIRCUIT BOARD
#5 | 2025-02-27PRINTED CIRCUIT BOARD
#6 | 2025-02-27PRINTED CIRCUIT BOARD
#7 | 2024-05-23PRINTED CIRCUIT BOARD
#8 | 2024-05-16PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
#9 | 2024-05-02Printed circuit board including bonding layer, having conductive particles, disposed between core portions
#10 | 2024-01-25PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRATED CIRCUIT PACKAGE
#11 | 2023-06-08ANTENNA SUBSTRATE AND ELECTRONIC DEVICE INCLUDING THE SAME
#12 | 2023-06-01Printed circuit board and method of manufacturing the same
#13 | 2023-06-01Printed circuit board and printed circuit board package
#14 | 2023-06-01Semiconductor package including heat dissipation structure
#15 | 2023-05-25Printed circuit board
#16 | 2023-04-06Electronic component embedded substrate
#17 | 2023-04-06Substrate having electric component embedded therein
#18 | 2022-11-10Printed circuit board
#19 | 2022-08-11Substrate structure and electronic device including the same
#20 | 2022-06-16Connection structure embedded substrate
#21 | 2021-12-30Printed circuit board
#22 | 2021-12-30Printed circuit board
#23 | 2021-09-23Substrate structure and electronic device including the same
#24 | 2021-09-16Substrate structure and electronic device including the same
#25 | 2021-06-24Electronic component-embedded substrate
#26 | 2021-06-17Electronic component embedded substrate
#27 | 2021-06-17Substrate on substrate structure and electronic device comprising the same
#28 | 2021-06-17Substrate-on-substrate structure and electronic device comprising the same
#29 | 2020-12-29Electronic component embedded substrate
#30 | 2020-12-03Electronic device for executing application by using phoneme information included in audio data and operation method therefor
#31 | 2020-10-15Semiconductor package
#32 | 2018-05-10Image sensor device and image sensor module comprising the same
#33 | 2017-10-12Substrate for camera module and camera module having the same
#34 | 2016-02-18Printed circuit board and method of manufacturing the same
#35 | 2016-02-18PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#36 | 2016-01-28PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#37 | 2015-12-17PACKAGE BOARD AND PACKAGE USING THE SAME
#38 | 2015-12-17PACKAGE BOARD AND PACKAGE USING THE SAME
#39 | 2015-12-03PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME
#40 | 2015-12-03PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME
#41 | 2015-11-26Circuit board, electronic component and method of manufacturing circuit board
#42 | 2015-07-09PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE USING THE SAME
#43 | 2015-06-25PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
1208391 ⎘