Yasuhiro CHIDA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2019-03-28

Top Assignees for applications by Yasuhiro CHIDA

The entities that hold a legal rights for patent applications filed by inventor CHIDA Yasuhiro:

Yasuhiro CHIDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGE SEALING STRUCTURE, DEVICE PACKAGE, AND PACKAGE SEALING METHOD

Heater for bonding apparatus and method of cooling the same

InventorID:

1211401 ⎘