Tokyo
Japan
186
2026-05-14
148
2025-11-25
These are the the leading inventors for applications assigned to SHINKAWA LTD.:
SHINKAWA LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
MOUNTING APPARATUS, MOUNTING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
#2 | 2026-04-30ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNTING METHOD
#3 | 2026-04-02MOUNTING APPARATUS, MOUNTING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM
#4 | 2025-04-10BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM
#5 | 2025-01-09MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
#6 | 2024-12-05INSPECTION DEVICE, MOUNTING APPARATUS, INSPECTION METHOD, AND NON-TRANSITORY COMPUTER READABLE RECORDING MEDIUM
#7 | 2024-11-14PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
#8 | 2024-09-26 ✅ Patent 12,480,762 granted on 2025-11-25MOUNTING DEVICE, AND METHOD FOR DETECTING DEGREE OF PARALLELISM OF MOUNTING DEVICE
#9 | 2024-09-12BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE MEDIUM
#10 | 2024-09-05 ✅ Patent 12,154,801 granted on 2024-11-26Wire tension adjustment method and wire tension adjuster
#11 | 2024-08-15FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS
#12 | 2024-07-18 ✅ Patent 12,489,003 granted on 2025-12-02WIRE BONDING SYSTEM, INSPECTION DEVICE, WIRE BONDING METHOD, AND RECORDING MEDIUM
#13 | 2024-06-20ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
#14 | 2024-05-30 ✅ Patent 12,298,358 granted on 2025-05-13Resistance wire abnormality detection device
#15 | 2024-05-16MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
#16 | 2024-04-18 ✅ Patent 12,475,551 granted on 2025-11-18MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#17 | 2024-04-11BONDING APPARATUS AND BONDING METHOD
#18 | 2024-03-28 ✅ Patent 12,080,679 granted on 2024-09-03Bonding apparatus and alignment method
#19 | 2024-03-28 ✅ Patent 12,374,650 granted on 2025-07-29MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#20 | 2024-03-14 ✅ Patent 12,616,049 granted on 2026-04-28WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM RECORDING PROGRAM
#21 | 2024-03-14 ✅ Patent 12,145,218 granted on 2024-11-19Flux transfer apparatus
#22 | 2024-03-07CONVEYANCE DEVICE, CONVEYANCE METHOD, AND NON-TRANSITORY COMPUTER READABLE MEDIUM
#23 | 2024-02-22MOUNTING HEAD
#24 | 2024-02-22SUCTION DEVICE, SUCTION UNIT, SUCTION METHOD, AND COMPUTER-READABLE RECORDING MEDIUM
#25 | 2024-02-15BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM
#26 | 2024-01-11 ✅ Patent 12,400,993 granted on 2025-08-26SUBSTRATE HOLDER AND BONDING SYSTEM
#27 | 2024-01-04 ✅ Patent 12,374,563 granted on 2025-07-29SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
#28 | 2023-12-07 ✅ Patent 12,487,076 granted on 2025-12-02MEASUREMENT DEVICE, MEASUREMENT METHOD, AND BONDING SYSTEM
#29 | 2023-11-02 ✅ Patent 12,131,921 granted on 2024-10-29Manufacturing apparatus of semiconductor device
#30 | 2023-10-26 ✅ Patent 12,046,574 granted on 2024-07-23Ultrasonic horn and manufacturing apparatus of semiconductor device
#31 | 2023-09-07 ✅ Patent 12,374,653 granted on 2025-07-29MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPARATUS
#32 | 2023-08-31 ✅ Patent 12,557,682 granted on 2026-02-17MOUNTING DEVICE AND MOUNTING METHOD
#33 | 2023-08-31POSITION CONTROL APPARATUS, POSITION CONTROL METHOD, POSITION CONTROL RECORDING MEDIUM, AND BONDING APPARATUS
#34 | 2023-08-24SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
#35 | 2023-07-20MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#36 | 2023-06-22 ✅ Patent 12,431,458 granted on 2025-09-30BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
#37 | 2023-06-08 ✅ Patent 12,261,148 granted on 2025-03-25Wire bonding apparatus
#38 | 2023-06-08WIRE STRUCTURE, WIRE STRUCTURE FORMATION METHOD, AND ELECTRONIC APPARATUS
#39 | 2023-06-08 ✅ Patent 12,551,926 granted on 2026-02-17ULTRASONIC HORN
#40 | 2023-05-25 ✅ Patent 12,107,067 granted on 2024-10-01Wire bonding device, wire cutting method and non-transitory computer-readable recording medium recording program
#41 | 2023-05-18 ✅ Patent 12,568,792 granted on 2026-03-03SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
#42 | 2023-04-27PICKUP APPARATUS AND PICKUP METHOD OF SEMICONDUCTOR DIE
#43 | 2023-04-27 ✅ Patent 12,057,427 granted on 2024-08-06Wire bonding apparatus
#44 | 2023-04-20 ✅ Patent 11,691,214 granted on 2023-07-04Ultrasound horn
#45 | 2022-12-29 ✅ Patent 12,191,276 granted on 2025-01-07Mounting apparatus
#46 | 2022-12-29 ✅ Patent 12,018,936 granted on 2024-06-25Mounting apparatus and parallelism detection method in mounting apparatus
#47 | 2022-12-22 ✅ Patent 12,136,604 granted on 2024-11-05Bonding apparatus and bonding method
#48 | 2022-11-10 ✅ Patent 12,563,999 granted on 2026-02-24MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#49 | 2022-10-20 ✅ Patent 12,557,600 granted on 2026-02-17SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
#50 | 2022-10-13 ✅ Patent 12,107,070 granted on 2024-10-01Wire bonding apparatus and method for manufacturing semiconductor device
#51 | 2022-10-06MOUNTING APPARATUS
#52 | 2022-10-06MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#53 | 2022-10-06 ✅ Patent 12,112,962 granted on 2024-10-08Arrangement apparatus and arrangement method
#54 | 2022-09-29 ✅ Patent 12,087,725 granted on 2024-09-10Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus
#55 | 2022-09-08VIBRATION DETECTION SYSTEM
#56 | 2022-08-11 ✅ Patent 12,176,317 granted on 2024-12-24Semiconductor device manufacturing device and manufacturing method
#57 | 2022-07-14 ✅ Patent 12,575,368 granted on 2026-03-10APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#58 | 2022-07-07 ✅ Patent 12,217,996 granted on 2025-02-04Conveying device
#59 | 2022-07-07 ✅ Patent 12,341,035 granted on 2025-06-24MOUNTING DEVICE
#60 | 2022-06-30 ✅ Patent 12,417,997 granted on 2025-09-16WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#61 | 2022-06-23 ✅ Patent 12,308,273 granted on 2025-05-20Bonding apparatus and method for correcting movement amount of bonding head
#62 | 2022-06-09WIRE SHAPE MEASUREMENT DEVICE, WIRE THREE-DIMENSIONAL IMAGE GENERATION METHOD, AND WIRE SHAPE MEASUREMENT METHOD
#63 | 2022-05-26 ✅ Patent 11,749,541 granted on 2023-09-05Bonding apparatus
#64 | 2022-05-12 ✅ Patent 11,908,827 granted on 2024-02-20Wire bonding apparatus
#65 | 2022-05-05 ✅ Patent 11,717,912 granted on 2023-08-08Capillary guide device and wire bonding apparatus
#66 | 2022-04-28 ✅ Patent 11,769,749 granted on 2023-09-26Mounting apparatus
#67 | 2022-04-28WIRE NON-ATTACHMENT INSPECTION SYSTEM, WIRE NON-ATTACHMENT DETECTION DEVICE, AND WIRE NON-ATTACHMENT DETECTION METHOD
#68 | 2022-02-10 ✅ Patent 11,910,534 granted on 2024-02-20Mounting apparatus
#69 | 2021-09-02 ✅ Patent 11,824,038 granted on 2023-11-21Wire bonding apparatus
#70 | 2021-08-19 ✅ Patent 11,296,048 granted on 2022-04-05Semiconductor chip mounting device and method for manufacturing semiconductor device
#71 | 2021-08-12 ✅ Patent 11,172,600 granted on 2021-11-09Mounting device
#72 | 2021-08-05 ✅ Patent 11,848,219 granted on 2023-12-19Mounting apparatus and film supply apparatus
#73 | 2021-08-05 ✅ Patent 11,315,808 granted on 2022-04-26Frame feeder
#74 | 2021-07-22 ✅ Patent 11,508,688 granted on 2022-11-22Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
#75 | 2021-07-15 ✅ Patent 11,159,706 granted on 2021-10-26Camera module manufacturing apparatus and camera module manufacturing method
#76 | 2021-07-01 ✅ Patent 11,367,703 granted on 2022-06-21Bonding apparatus
#77 | 2021-07-01DETACHMENT DEVICE
#78 | 2021-06-17FLUX TRANSFER APPARATUS
#79 | 2021-06-10 ✅ Patent 11,616,041 granted on 2023-03-28Mounting apparatus
#80 | 2021-01-07 ✅ Patent 11,024,596 granted on 2021-06-01Bonding apparatus and bonding method
#81 | 2020-12-31 ✅ Patent 11,410,866 granted on 2022-08-09Apparatus and method for linearly moving movable body relative to object
#82 | 2020-12-10 ✅ Patent 11,508,599 granted on 2022-11-22Pick-up device and pick-up method
#83 | 2020-12-10 ✅ Patent 11,182,921 granted on 2021-11-23Wire shape inspecting apparatus and wire shape inspecting method
#84 | 2020-11-26 ✅ Patent 11,373,975 granted on 2022-06-28Electronic component mounting device
#85 | 2020-11-19 ✅ Patent 11,562,916 granted on 2023-01-24Mounting apparatus and temperature measurement method
#86 | 2020-10-29 ✅ Patent 11,509,126 granted on 2022-11-22Wiring structure with movement mechanism
#87 | 2020-10-08 ✅ Patent 11,069,651 granted on 2021-07-20Method of mounting die
#88 | 2020-09-17 ✅ Patent 10,964,661 granted on 2021-03-30Wire bonding apparatus, circuit for wire bonding apparatus, and method for manufacturing semiconductor device
#89 | 2020-09-17 ✅ Patent 11,512,411 granted on 2022-11-29PTFE sheet and method for mounting die
#90 | 2020-09-10 ✅ Patent 11,201,132 granted on 2021-12-14Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus
#91 | 2020-09-10 ✅ Patent 11,069,650 granted on 2021-07-20Bonding condition evaluation apparatus
#92 | 2020-09-10 ✅ Patent 11,410,960 granted on 2022-08-09Bonding apparatus
#93 | 2020-09-03 ✅ Patent 11,469,125 granted on 2022-10-11Device and method for linearly moving first and second moving bodies relative to target object
#94 | 2020-08-27 ✅ Patent 11,521,890 granted on 2022-12-06Apparatus for manufacturing semiconductor device
#95 | 2020-08-06 ✅ Patent 10,978,420 granted on 2021-04-13Semiconductor chip mounting apparatus and semiconductor chip mounting method
#96 | 2020-08-06 ✅ Patent 11,139,193 granted on 2021-10-05Device and method for positioning first object in relation to second object
#97 | 2020-07-30 ✅ Patent 11,387,211 granted on 2022-07-12Bonding apparatus and bonding method
#98 | 2020-07-30 ✅ Patent 11,094,567 granted on 2021-08-17Mounting apparatus and method for manufacturing semiconductor device
#99 | 2020-07-23 ✅ Patent 11,508,689 granted on 2022-11-22Mounting apparatus and mounting system
#100 | 2020-06-25 ✅ Patent 11,450,640 granted on 2022-09-20Wire bonding apparatus and manufacturing method for semiconductor apparatus
Also check out SHINKAWA LTD.'s (Tokyo, Japan) applicant profile with 131 patent applications submitted.
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