Regensburg
Germany
28
2025-04-17
The entities that hold a legal rights for patent applications filed by inventor Strobel Peter:
Peter Strobel from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF MANUFACTURING A CHIP STRUCTURE AND CHIP STRUCTURE
#2 | 2021-04-15Package with separate substrate sections
#3 | 2021-01-14Die attach methods and semiconductor devices manufactured based on such methods
#4 | 2021-01-07Processing of one or more carrier bodies and electronic components by multiple alignment
#5 | 2020-12-17Method and Structure for Supporting Thin Semiconductor Chips with a Metal Carrier
#6 | 2019-11-14Die attach methods and semiconductor devices manufactured based on such methods
#7 | 2018-02-08Die attach methods and semiconductor devices manufactured based on such methods
#8 | 2016-02-11Batch process for connecting chips to a carrier
#9 | 2015-07-09Chip arrangement and method of manufacturing the same
#10 | 2010-09-16Reconfigured wafer alignment
#11 | 2010-03-04METHOD FOR APPLYING AN ADHESIVE LAYER ON THIN CUT SEMICONDUCTOR CHIPS OF SEMICONDUCTOR WAFERS
#12 | 2008-10-02Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#13 | 2008-09-02Electronic component and semiconductor wafer, and method for producing the same
#14 | 2008-02-28Semiconductor component with plastic housing, and process for producing the same
#15 | 2008-02-21Plastic housing and semiconductor component with said plastic housing
#16 | 2008-01-24Electronic circuit in a package-on-package configuration and method for producing the same
#17 | 2007-06-07Sensor component and panel used for the production thereof
#18 | 2007-05-10Method for coating a structure comprising semiconductor chips
#19 | 2007-04-19Method for applying a structure of joining material to the back surfaces of semiconductor chips
#20 | 2007-04-12Semiconductor device with semiconductor chip and adhesive film and method for producing the same
#21 | 2007-03-15External contact material for external contacts of a semiconductor device and method of making the same
#22 | 2007-02-22Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#23 | 2006-11-09Electronic module and method for the production thereof
#24 | 2006-08-10Smart card, smart card module, and a method for production of a smart card module
#25 | 2006-06-15Electronic component and a panel
#26 | 2006-04-13Semiconductor component with plastic housing, and process for producing the same
#27 | 2005-04-28Electronic module having plug contacts and method for producing it
#28 | 2005-03-10Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof
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