Seoul
South Korea
72
2016-10-27
The entities that hold a legal rights for patent applications filed by inventor KWEON Young Do:
Young Do KWEON from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Printed circuit board
#2 | 2016-06-09CIRCUIT BOARD, PACKAGE SUBSTRATE AND ELECTRONIC DEVICE
#3 | 2014-09-11PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#4 | 2014-02-20Method of fabricating a package substrate
#5 | 2013-07-04Common mode filter and method for manufacturing the same
#6 | 2013-07-04CIRCUIT BOARD
#7 | 2013-06-27Chip inductor and method for manufacturing the same
#8 | 2013-06-20PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
#9 | 2013-06-13METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
#10 | 2013-05-02Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate
#11 | 2013-04-04PRINTED CIRCUIT BOARD
#12 | 2013-03-07DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME
#13 | 2013-01-31Method for manufacturing interposer
#14 | 2013-01-03Wafer Level Package For Heat Dissipation And Method Of Manufacturing The Same
#15 | 2012-11-22METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#16 | 2012-10-18DEVICE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#17 | 2012-06-28Semiconductor package with a metal post and manufacturing method thereof
#18 | 2012-06-28SUBSTRATE FOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#19 | 2012-06-21METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD
#20 | 2012-05-24METHOD OF MANUFACTURING WAFER LEVEL PACKAGE
#21 | 2012-04-12METHOD OF MANUFACTURING BLOCK MODULE
#22 | 2012-03-29Method of manufacturing printed circuit board
#23 | 2012-03-29Printed circuit board and manufacturing method thereof
#24 | 2012-03-22Interposer-embedded printed circuit board
#25 | 2012-01-26SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#26 | 2012-01-19PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#27 | 2011-12-22Semiconductor package module and electric circuit assembly with the same
#28 | 2011-12-08Semiconductor package with a conductive shielding member
#29 | 2011-11-10Resistor having parallel structure and method of fabricating the same
#30 | 2011-11-03Circuit board and method for manufacturing the same
#31 | 2011-10-13Package substrate and fabricating method thereof
#32 | 2011-08-18Method of manufacturing wafer level package including coating resin over the dicing lines
#33 | 2011-08-18Semiconductor chip package and method of manufacturing the same
#34 | 2011-07-21Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure
#35 | 2011-06-30PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME
#36 | 2011-06-02Method of manufacturing a dual face package
#37 | 2011-06-02Method of manufacturing stacked wafer level package
#38 | 2011-05-12Semiconductor package and manufacturing method thereof
#39 | 2011-03-17Device package substrate and method of manufacturing the same
#40 | 2011-03-17Interposer and method for manufacturing the same
#41 | 2011-03-03Circuit board, semiconductor package and method of manufacturing the same
#42 | 2011-02-24Method of manufacturing wafer level device package
#43 | 2011-02-24Die package and method of manufacturing the same
#44 | 2011-02-17Method of manufacturing a capacitor-embedded printed circuit board
#45 | 2010-12-30Semiconductor chip package and method of manufacturing the same
#46 | 2010-12-23Die package including encapsulated die and method of manufacturing the same
#47 | 2010-09-30Method of manufacturing printed circuit board
#48 | 2010-08-05Wafer Level package for heat dissipation and method of manufacturing the same
#49 | 2010-06-24Method of manufacturing wafer level package including coating and removing resin over the dicing lines
#50 | 2010-06-17Semiconductor stack package
#51 | 2010-06-10Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer
#52 | 2010-06-03Wafer level package with removable chip protecting layer
#53 | 2010-05-13Stacked wafer level package and method of manufacturing the same
#54 | 2010-04-29Dual face package having resin insulating layer
#55 | 2010-04-22Semiconductor package with a metal post
#56 | 2010-04-08Method for manufacturing a semiconductor package
#57 | 2010-04-08Method of manufacturing a semiconductor package
#58 | 2010-04-08Semiconductor package
#59 | 2009-12-17Wafer level package and manufacturing method thereof
#60 | 2009-10-08Solder ball attachment jig and method for manufacturing semiconductor device using the same
#61 | 2009-10-01Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof
#62 | 2009-07-02Semiconductor device and method of manufacturing the same
#63 | 2009-07-02Semiconductor device and method of manufacturing the same
#64 | 2009-05-14Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar
#65 | 2009-05-14Method of manufacturing a package board
#66 | 2009-04-02Method of manufacturing wafer level package
#67 | 2009-03-19Semiconductor chip package and printed circuit board
#68 | 2009-03-19Printed circuit board having embedded components and method for manufacturing thereof
#69 | 2009-02-19Capacitor-embedded printed circuit board and manufacturing method thereof
#70 | 2009-02-19CMOS image sensor package
#71 | 2008-12-18Semiconductor package and method for manufacturing thereof
#72 | 2008-12-04Wafer level package of image sensor and method for manufacturing the same
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