Sunnyvale, California
United States
66
2025-06-05
The entities that hold a legal rights for patent applications filed by inventor Wang Yan:
Yan Wang from Sunnyvale, US has applied for patents for these inventions. The list has both pending applications and granted patents:
System and Process with Power Jet Modules and Method thereof
#2 | 2025-03-06IMPLEMENTING AUTONOMOUS VEHICLE LANE UNDERSTANDING SYSTEMS USING FILTER-BASED LANE TRACKING
#3 | 2025-02-20Processing System and Method for Producing a Particulate Material
#4 | 2024-03-07SYSTEM AND PROCESS WITH ASSISTED GAS FLOW INSIDE A REACTION CHAMBER
#5 | 2023-08-10System with power jet modules and method thereof
#6 | 2023-06-01Processing system and method for producing a particulate material
#7 | 2022-09-22Processing system and method for producing a particulate material
#8 | 2022-06-30Method and System for High-Yield Dynamic Crystallization Manufacturing of Battery Materials
#9 | 2022-03-17Recommending edges via importance aware machine learned model
#10 | 2022-02-03System with power jet modules and method thereof
#11 | 2021-12-30System and process with assisted gas flow inside a reaction chamber
#12 | 2021-04-01Inference via edge label propagation in networks
#13 | 2020-12-31System with power jet modules and method thereof
#14 | 2020-12-31Processing system and method for producing a particulate material
#15 | 2016-03-24Adaptively controlled pre-distortion circuits for RF power amplifiers
#16 | 2015-08-27In-service monitoring and cancellation of passive intermodulation interferences
#17 | 2015-07-30Adaptively controlled digital pre-distortion in an RF power amplifier using an integrated signal analyzer with enhanced analog-to-digital conversion
#18 | 2014-11-20Crest factor reduction for brand-limited multi-carrier signals
#19 | 2014-04-22Self-adaptive power amplification
#20 | 2013-09-10Integrated signal analyzer for adaptive control of mixed-signal integrated circuits
#21 | 2013-01-03FORMATION OF III-V MATERIALS USING MOCVD WITH CHLORINE CLEANS OPERATIONS
#22 | 2012-12-20Automatic probe configuration station and method therefor
#23 | 2012-03-27Integrated signal analyzer for adaptive control of mixed-signal integrated circuit
#24 | 2011-06-09LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING
#25 | 2011-03-03METHOD AND APPARATUS FOR LOCAL POLISHING CONTROL
#26 | 2010-11-30Method and apparatus for local polishing control
#27 | 2010-10-21POLISHING PAD WITH PROJECTING PORTION
#28 | 2010-04-22COMPOSITIONS AND METHODS FOR BARRIER LAYER POLISHING
#29 | 2009-03-05ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE
#30 | 2008-11-13METHOD AND PAD DESIGN FOR THE REMOVAL OF BARRIER MATERIAL BY ELECTROCHEMICAL MECHANICAL PROCESSING
#31 | 2008-05-08Conductive Polishing Article for Electrochemical Mechanical Polishing
#32 | 2008-02-28Endpoint for electroprocessing
#33 | 2008-02-28ELECTROPROCESSING PROFILE CONTROL
#34 | 2008-02-21Electroprocessing profile control
#35 | 2008-02-14RETAINING RING WITH CONDUCTIVE PORTION
#36 | 2008-01-03SYSTEM AND METHOD FOR IN-SITU HEAD RINSE
#37 | 2007-12-27METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
#38 | 2007-10-18Planarization of substrates at a high polishing rate using electrochemical mechanical polishing
#39 | 2007-09-20Methods and apparatus for electroprocessing with recessed bias contact
#40 | 2007-06-19Method and composition for polishing a substrate
#41 | 2007-06-12Hydrogen bubble reduction on the cathode using double-cell designs
#42 | 2007-05-03Conductive pad with ion exchange membrane for electrochemical mechanical polishing
#43 | 2007-05-03BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION
#44 | 2007-04-19Contact assembly cleaning in an electrochemical mechanical processing apparatus
#45 | 2007-03-22Conductive polishing article for electrochemical mechanical polishing
#46 | 2007-02-15Pad assembly for electrochemical mechanical processing
#47 | 2007-01-09Method and composition for polishing a substrate
#48 | 2006-10-31Method and composition for polishing a substrate
#49 | 2006-08-03Conductive polishing article for electrochemical mechanical polishing
#50 | 2006-07-27Electroprocessing profile control
#51 | 2006-07-18Pad assembly for electrochemical mechanical processing
#52 | 2006-06-27Conductive polishing article for electrochemical mechanical polishing
#53 | 2006-06-15Method and apparatus for local polishing control
#54 | 2006-03-02Method and apparatus for reduced wear polishing pad conditioning
#55 | 2006-01-31Conductive polishing article for electrochemical mechanical polishing
#56 | 2006-01-24Conductive polishing article for electrochemical mechanical polishing
#57 | 2006-01-12Method and composition for polishing a substrate
#58 | 2005-12-27Conductive polishing article for electrochemical mechanical polishing
#59 | 2005-12-22Retaining ring with conductive portion
#60 | 2005-10-06Multi-layer polishing pad for low-pressure polishing
#61 | 2005-07-28Control circuit for IEEE 1394b optical transmission protocol
#62 | 2005-06-23Conductive polishing article for electrochemical mechanical polishing
#63 | 2005-05-31Electrolyte composition and treatment for electrolytic chemical mechanical polishing
#64 | 2005-03-24Endpoint compensation in electroprocessing
#65 | 2005-01-06Method and apparatus for electrochemical mechanical processing
#66 | 2005-01-04Endpoint detection for electro chemical mechanical polishing and electropolishing processes
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