Ajay Kumar

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGULATION OF WAFERS

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate breakthrough treatment

Mitigation of particle contamination for wafer dicing processes

Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process

APPARATUS AND METHODS FOR DRY ETCH WITH EDGE, SIDE AND BACK PROTECTION

Wafer dicing using femtosecond-based laser and plasma etch

Mitigation of particle contamination for wafer dicing processes

Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Etch mask for hybrid laser scribing and plasma etch wafer singulation process

Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process

Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process

Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch

Method for improving CD micro-loading in photomask plasma etching

UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach

HYBRID WAFER DICING APPROACH USING A POLYGON SCANNING-BASED LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

DYNAMIC ION RADICAL SIEVE AND ION RADICAL APERTURE FOR AN INDUCTIVELY COUPLED PLASMA (ICP) REACTOR

Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process

Wafer dicing using femtosecond-based laser and plasma etch

Transfer arm for film frame substrate handling during plasma singulation of wafers

Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process

Proximity contact cover ring for plasma dicing

Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process

Methods and apparatus for controlling photoresist line width roughness with enhanced electron spin control

Method of outgassing a mask material deposited over a workpiece in a process tool

Plasma reactor having an array of plural individually controlled gas injectors arranged along a circular side wall

Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch

Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process

Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process

Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process

CARRIER WITH THERMALLY RESISTANT FILM FRAME FOR SUPPORTING WAFER DURING SINGULATION

Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile

Dicing tape protection for wafer dicing using laser scribe process

Wafer edge warp suppression for thin wafer supported by tape frame

Dicing wafers having solder bumps on wafer backside

Method of die singulation using laser ablation and induction of internal defects with a laser

Water soluble mask formation by dry film lamination

Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach

HYBRID WAFER DICING APPROACH USING COLLIMATED LASER SCRIBING PROCESS AND PLASMA ETCH

Dicing processes for thin wafers with bumps on wafer backside

Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination

APPROACHES FOR CLEANING A WAFER DURING HYBRID LASER SCRIBING AND PLASMA ETCHING WAFER DICING PROCESSES

Baking tool for improved wafer coating process

Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing

Hybrid dicing process using a blade and laser

HYBRID WAFER DICING APPROACH USING TEMPORALLY-CONTROLLED LASER SCRIBING PROCESS AND PLASMA ETCH

Dicing tape thermal management by wafer frame support ring cooling during plasma dicing

Wafer coating

Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing

Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance

Singulation of wafers having wafer-level underfill

LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND CLEAN SIDEWALL

Residue removal from singulated die sidewall

Method and carrier for dicing a wafer

Screen print mask for laser scribe and plasma etch wafer dicing process

LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE ADHESIVE FILM

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean

Maskless hybrid laser scribing and plasma etching wafer dicing process

Maskless hybrid laser scribing and plasma etching wafer dicing process

Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean

Method and apparatus for dicing wafers having thick passivation polymer layer

METHOD OF DICED WAFER TRANSPORTATION

Pre-patterned dry laminate mask for wafer dicing processes

Electrodes for etch

Wafer coating

Wafer dicing from wafer backside and front side

ALTERNATING MASKING AND LASER SCRIBING APPROACH FOR WAFER DICING USING LASER SCRIBING AND PLASMA ETCH

Substrate patterning using hybrid laser scribing and plasma etching processing schemes

Laser-dominated laser scribing and plasma etch hybrid wafer dicing

Wafer dicing method for improving die packaging quality

METHOD AND SYSTEM FOR LASER FOCUS PLANE DETERMINATION IN A LASER SCRIBING PROCESS

WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HYBRID APPROACH

Water soluble mask formation by dry film lamination

LASER SCRIBING AND PLASMA ETCH FOR HIGH DIE BREAK STRENGTH AND SMOOTH SIDEWALL

Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing

Method of coating water soluble mask for laser scribing and plasma etch

Methods for reducing line width roughness and/or critical dimension nonuniformity in a patterned photoresist layer

Photoresist treatment method by low bombardment plasma

Wafer dicing using femtosecond-based laser and plasma etch

Wafer edge warp supression for thin wafer supported by tape frame

Dicing wafers having solder bumps on wafer backside

LASER, PLASMA ETCH, AND BACKSIDE GRIND PROCESS FOR WAFER DICING

CHARGED BEAM PLASMA APPARATUS FOR PHOTOMASK MANUFACTURE APPLICATIONS

Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach

METHODS FOR ETCHING A SUBSTRATE

Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes

Method for improving CD micro-loading in photomask plasma etching

SUBSTRATE LASER DICING MASK INCLUDING LASER ENERGY ABSORBING WATER-SOLUBLE FILM

Method and apparatus for high efficiency gas dissociation in inductive coupled plasma reactor

Apparatus and methods for fabricating a photomask substrate for EUV applications

CONTAMINATION PREVENTION FOR PHOTOMASK IN EXTREME ULTRAVIOLET LITHOGRAPHY APPLICATION

Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers

Wafer dicing with etch chamber shield ring for film frame wafer applications

METHOD AND APPARATUS FOR PHOTOMASK PLASMA ETCHING

Wafer dicing from wafer backside