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Inventor profile of:

Robert Lanzone

City:

Chandler, Arizona

Country:

United States

Published Applications:

Last publication date:

2024-11-28

Top Assignees for applications by Robert Lanzone

The entities that hold a legal rights for patent applications filed by inventor Lanzone Robert:

AMKOR TECHNOLOGY, INC. 5 Chandler, AZ United States
Amkor Technology Singapore Holding Pte. Ltd. 3 Singapore, Singapore
AMKOR TECHNOLOGY, INC. 2 Tempe, AZ United States

Recent patent applications by Lanzone Robert

Robert Lanzone from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-11-28

US20240395771A1

Electricity

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

#2 | 2023-04-20

US20230118400A1

Electricity

Semiconductor package and manufacturing method thereof

#3 | 2021-07-15

US20210217725A1

Electricity

Semiconductor package and manufacturing method thereof

#4 | 2018-11-08

US20180323170A1

Electricity

Semiconductor package and manufacturing method thereof

#5 | 2018-05-17

US20180138155A1

Electricity

Semiconductor package and manufacturing method thereof

#6 | 2016-01-26

US13765388

Electricity

Electronic component package fabrication method and structure

#7 | 2015-11-26

US20150340332A1

Electricity

Copper pillar sidewall protection

#8 | 2015-08-06

US20150221570A1

Electricity

THIN SANDWICH EMBEDDED PACKAGE

#9 | 2015-03-03

US12913376

Low stress substrate and formation method

#10 | 2013-10-22

US12730062

Semiconductor package thermal tape window frame for heat sink attachment

#11 | 2013-10-08

US13327440

Electronic component package fabrication method and structure

InventorID:

1250871 ⎘