AMKOR TECHNOLOGY, INC.

Semiconductor device and manufacturing method thereof

Copper pillar sidewall protection

Semicondutor device with through-silicon via-less deep wells

Molded cavity substrate MEMS package fabrication method and structure

Apparatus and method for testing sound transducers

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Low stress substrate and formation method

Electronic device package structure and method of fabricating the same

Mushroom shaped bump on repassivation

Processing solderbrace using light wavelength filter and a broadband light source

Die seal design and method and apparatus for integrated circuit production

Semiconductor device

Semiconductor device with plated pillars and leads

Thin stackable package and method

Semiconductor device with micro electromechanical system die

Method for controlling molding compound geometry around a semiconductor die

Micro lead frame structure having reinforcing portions and method

Semiconductor device with increased I/O configuration

Through wafer via structures for concentrated photovoltaic cells

Frame interconnect for concentrated photovoltaic module

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Concentrated photovoltaic receiver package with built-in connector

Semiconductor device with increased I/O leadframe

Molded light guide for concentrated photovoltaic receiver module

Semiconductor device using EMC wafer support system and fabricating method thereof

Semiconductor device and manufacturing method thereof

Package of finger print sensor and fabricating method thereof

Conformal shield on punch QFN semiconductor package

Semiconductor package with patterning layer and method of making same

Method and system for a semiconductor device package with a die-to-die first bond

Methods for temporary wafer molding for chip-on-wafer assembly

Land structure for semiconductor package and method therefor

Fingerprint sensor package and method

Leadframe structure for concentrated photovoltaic receiver package

Wafer level fan-out package with a fiducial die

Semiconductor device including leadframe with downsets

Lead frame package having discharge holes and method of manufacturing the same

Semiconductor package and method for manufacturing the same

Electronic assembly having increased standoff height

Semiconductor device having conductive pads to prevent solder reflow

Semiconductor device with increased I/O leadframe including power bars

Method of forming a thin substrate chip scale package device and structure

Semiconductor package thermal tape window frame for heat sink attachment

Package in package device for RF transceiver module

Semiconductor device having overlapped via apertures

Molded semiconductor package with snap lid

Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe

Shielded package having shield lid

Electronic component package fabrication method and structure

Conductive pad on protruding through electrode semiconductor device

Wafer level fan out package

Conductive paste and mold for electrical connection of photovoltaic die to substrate

Routable single layer substrate and semiconductor package including same

Exposed die overmolded flip chip package and fabrication method

Metal mesh lid MEMS package and method

Light emitting diode (LED) package and method

Flex circuit package and method

Fine pitch copper pillar package and method

Semiconductor device and fabricating method thereof

Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same

System and method for lowering contact resistance of the radio frequency (RF) shield to ground

Direct-write wafer level chip scale package

Concentrated photovoltaic receiver package with stacked internal support features

Semiconductor device capable of preventing dielectric layer from cracking

Leadframe and semiconductor package made using the leadframe

Wafer level package and fabrication method

Semiconductor device having through electrodes protruding from dielectric layer

Package in package semiconductor device with film over wire

Stackable package and method

Exposed die overmolded flip chip package and fabrication method

Stackable variable height via package and method

Semiconductor package and manufacturing method thereof

Stackable semiconductor package

Heat spreader package

Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package

Through via connected backside embedded circuit features structure and method

Semiconductor device with metal dam and fabricating method

Increased I/O leadframe and semiconductor device including same

Shielded embedded electronic component substrate fabrication method and structure

Bumped chip package

Flip chip bump structure and fabrication method

Through via recessed reveal structure and method

Metal etch stop fabrication method and structure

Exposed die overmolded flip chip package

Bend test method and apparatus for flip chip devices

Semiconductor device and manufacturing method thereof

Shielded package having shield lid

Conductive polymer lid for a sensor package and method therefor

Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor

Buildup dielectric layer having metallization pattern semiconductor package fabrication method

Mechanical tape separation package and method

Stackable plasma cleaned via package and method

Semiconductor device having insulating and interconnection layers

Through via nub reveal method and structure

Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns

Straight conductor blind via capture pad structure and fabrication method

Integrated circuit package and method of making the same