Kalispell, Montana
United States
6
2025-02-13
The entities that hold a legal rights for patent applications filed by inventor Lee Sam K.:
Sam K. Lee from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICONDUCTOR PLATING PROCESSES
#2 | 2023-12-21MODEL-BASED PARAMETER ADJUSTMENTS FOR DEPOSITION PROCESSES
#3 | 2023-09-07Plating and deplating currents for material co-planarity in semiconductor plating processes
#4 | 2016-11-17METHODS FOR INCREASING THE RATE OF ELECTROCHEMICAL DEPOSITION
#5 | 2015-08-13Electroplating methods for semiconductor substrates
#6 | 2014-09-18ELECTROPLATING PROCESSOR WITH WAFER HEATING OR COOLING
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