Prashant Kumar KULSHRESHTHA

CARBON GAPFILL LAYER FORMATION

FAST CARBON PLUGFILL FOR PATTERNS WITH LARGE CRITICAL DIMENSIONS

COMPONENT, SYSTEM, AND METHOD FOR IMPROVED FORELINE CLEANING

PROCESS STAGE TRANSITION DETECTION FOR PLASMA SYSTEMS

UNIFORM GAPFILL DEPOSITION ON SEMICONDUCTOR SUBSTRATES WITH VARYING GEOMETRIES

CHAMBER AND METHODS FOR DOWNSTREAM RESIDUE MANAGEMENT

PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION OF CARBON HARD-MASK

THROTTLE VALVE AND FORELINE CLEANING USING A MICROWAVE SOURCE

METHODS AND APPARATUS FOR MINIMIZING SUBSTRATE BACKSIDE DAMAGE

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Electrostatic chuck design with improved chucking and arcing performance

Pedestal for substrate processing chambers

METHODS OF REDUCING CHAMBER RESIDUES

Highly etch selective amorphous carbon film

Highly etch selective amorphous carbon film

Clean processes for boron carbon film deposition

Faceplate with edge flow control

Nitrogen-doped carbon hardmask films

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Targeted heat control systems

Dual RF for controllable film deposition

Faceplate having blocked center hole

Reduced hydrogen deposition processes

Reduced defect deposition processes

SYSTEMS AND METHODS OF FORMATION OF A METAL HARDMASK IN DEVICE FABRICATION

Plasma-enhanced chemical vapor deposition of carbon hard-mask

ELECTROSTATIC CHUCK FOR DAMAGE-FREE SUBSTRATE PROCESSING

RESOLVING SPONTANEOUS ARCING DURING THICK FILM DEPOSITION OF HIGH TEMPERATURE AMORPHOUS CARBON DEPOSITION

Methods and apparatus for minimizing substrate backside damage

Methods of reducing chamber residues

Deposition of metal silicide layers on substrates and chamber components

Highly etch selective amorphous carbon film

PLASMA DENSIFICATION WITHIN A PROCESSING CHAMBER

Electrostatic chucking process

METHOD OF PROCESSING A SUBSTRATE

METHOD FOR CLEANING PROCESS CHAMBER

METHOD AND TOOL FOR ELECTROSTATIC CHUCKING

Loadlock integrated bevel etcher system

Heated pedestal design for improved heat transfer and temperature uniformity

Pedestal for substrate processing chambers

Electrostatic chuck design with improved chucking and arcing performance

PROCESS CHAMBER COMPONENT CLEANING METHOD

Loadlock integrated bevel etcher system

Selective deposition of hardmask

Graded in-situ charge trapping layers to enable electrostatic chucking and excellent particle performance for boron-doped carbon films

Highly etch selective amorphous carbon film

Ultra-high modulus and etch selectivity boron carbon hardmask films

Deposition of metal silicide layers on substrates and chamber components

Gas flow profile modulated control of overlay in plasma CVD films

Thick tungsten hardmask films deposition on high compressive/tensile bow wafers

Cleaning process for removing boron-carbon residuals in processing chamber at high temperature

METHOD AND APPARATUS FOR CLAMPING AND DECLAMPING SUBSTRATES USING ELECTROSTATIC CHUCKS

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Loadlock integrated bevel etcher system

Methods to improve in-film particle performance of amorphous boron-carbon hardmask process in PECVD system

Graded in-situ charge trapping layers to enable electrostatic chucking and excellent particle performance for boron-doped carbon films

Gas flow profile modulated control of overlay in plasma CVD films

Gas flow profile modulated control of overlay in plasma CVD films

Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system

CLEANING PROCESS FOR CLEANING AMORPHOUS CARBON DEPOSITION RESIDUALS USING LOW RF BIAS FREQUENCY APPLICATIONS