Jeonghoon OH

MEMBRANE DESIGN FOR RECTANGULAR SUBSTRATE POLISHING BY CHEMICAL MECHANICAL POLISHING

RETAINING RING FOR CMP

CONTROL OF PLATEN EDGE-SHAPE IN CHEMICAL MECHANICAL POLISHING

MEMBRANE FOR APPLYING PRESSURE TO PAD IN CHEMICAL MECHANICAL POLISHING

FLEXURE MOUNTED PAD FOR CHEMICAL MECHANICAL POLISHING

CHEMICAL MECHANICAL POLISHING USING FLEXURE MOUNTED PAD

RETAINING RING HAVING INNER SURFACES WITH FEATURES

IN-SITU CONDITIONER DISK CLEANING DURING CMP

EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING

CONTACT CLEANING UNITS IN CMP POLISHER

ELECTRICAL CONNECTION FOR CHEMICAL MECHANICAL POLISHING CARRIER HEAD

POLISHING HEAD WITH RETAINING RING WEAR SENSING

HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRATE THICKNESS

CMP WITH INDIVIDUALLY ROTATABLE PLATENS

INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

POLISHING HEAD WITH FLEXURE EXTENDING THROUGH PRESSURE CHAMBER

CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES

POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL

GAS AMPLIFIER FOR CMP COOLING

CONTROL OF PLATEN SHAPE IN CHEMICAL MECHANICAL POLISHING

METHOD AND APPARATUS TO CLEAN SUBSTRATE WITH ATOMIZING NOZZLE

CHEMICAL MECHANICAL POLISH PAD CONDITIONER WITH MULTIPLE DISKS

STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING

RETAINING RING HAVING INNER SURFACES WITH FEATURES

METHODS FOR UPPER PLATEN MANUFACTURING

APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY

CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE

CARRIER HEAD ACOUSTIC MONITORING WITH SENSOR IN PLATEN

ACOUSTIC CARRIER HEAD MONITORING

POLISHING SYSTEM WITH PLATEN FOR SUBSTRATE EDGE CONTROL

RETAINER FOR CHEMICAL MECHANICAL POLISHING CARRIER HEAD

PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU PAD CONDITIONING

MULTIPLE DISK PAD CONDITIONER

MINIMIZING SUBSTRATE BOW DURING POLISHING

CONTROL OF PLATEN SHAPE IN CHEMICAL MECHANICAL POLISHING

IN-SITU CONDITIONER DISK CLEANING DURING CMP

CONDENSED GAS PAD CONDITIONER

ACOUSTIC MONITORING OF CONDITIONER DURING POLISHING

MONITORING OF ACOUSTIC EVENTS ON A SUBSTRATE

ACOUSTIC MONITORING OF CMP RETAINING RING

CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING

OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING

POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL

COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM

Retaining ring having inner surfaces with facets

EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING

Method of forming retaining ring with shaped surface

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

Retaining ring having inner surfaces with features

CHEMICAL MECHANICAL POLISHING VIBRATION MEASUREMENT USING OPTICAL SENSOR

Polishing system with annular platen or polishing pad

METHOD OF DETECTING CHEMICAL MECHANICAL POLISHING CONDITIONING DISK ORIENTATION

Asymmetry correction via variable relative velocity of a wafer

Methods and apparatus for processing a substrate using improved shield configurations

Methods and apparatus for processing a substrate using improved shield configurations

RETAINING RING DESIGN

Magnetron assembly having coolant guide for enhanced target cooling

SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENS

Retaining ring with shaped surface and method of forming

Sequential application of cleaning fluids for improved maintenance of chemical mechanical polishing systems

Edge load ring

Parameter sensing and computer modeling for gas delivery health monitoring

SUBSTRATE HANDLING SYSTEMS AND METHODS FOR CMP PROCESSING

Methods of detecting non-conforming substrate processing events during chemical mechanical polishing

Retaining ring having inner surfaces with facets

Retaining ring with shaped surface

Sputtering target with backside cooling grooves

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC POLISH (LSP)

Chemical mechanical polishing system with platen temperature control

Three-zone carrier head and flexible membrane

Polishing system with platen for substrate edge control

Retaining ring having inner surfaces with features

Methods for a web-based CMP system

Temperature control of chemical mechanical polishing

Temperature Control of Chemical Mechanical Polishing

Retaining ring for CMP

Monitoring of vibrations during chemical mechanical polishing

Reinforcement ring for carrier head with flexible membrane

Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes

Retaining ring design

METHOD OF IDENTIFYING AND TRACKING ROLL TO ROLL POLISHING PAD MATERIALS DURING PROCESSING

Sputtering target with backside cooling grooves

SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC POLISH (LSP)

Retaining ring with shaped surface

ANTI-ARC ZERO FIELD PLATE

Polishing system with annular platen or polishing pad for substrate monitoring

Gas cooled substrate support for stabilized high temperature deposition

Retaining ring for CMP

Sputtering target with backside cooling grooves

Methods for the continuous processing of substrates

Textured small pad for chemical mechanical polishing

Local area polishing system and polishing pad assemblies for a polishing system

Polishing system with local area rate control and oscillation mode

SYSTEMS, APPARATUS, AND METHODS FOR AN IMPROVED POLISHING HEAD GIMBAL USING A SPHERICAL BALL BEARING

Retaining ring having inner surfaces with facets

Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes

Gas cooled substrate support for stabilized high temperature deposition