🔗 Permalink

Inventor profile of:

Deepak Goyal

City:

Phoenix, Arizona

Country:

United States

Published Applications:

27

Last publication date:

2022-06-23

Top Assignees for applications by Deepak Goyal

The entities that hold a legal rights for patent applications filed by inventor Goyal Deepak:

INTEL CORPORATION 22 Santa Clara, CA United States

Recent patent applications by Goyal Deepak

Deepak Goyal from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-06-23

US20220199482A1

TEC-embedded dummy die to cool the bottom die edge hotspot

#2 | 2021-12-30

US20210407833A1

Method and device for failure analysis using RF-based thermometry

#3 | 2021-11-25

US20210364474A1

Method, device and system for non-destructive detection of defects in a semiconductor die

#4 | 2021-06-24

US20210193552A1

Thermally conductive slugs/active dies to improve cooling of stacked bottom dies

#5 | 2021-05-06

US20210132113A1

Integrated cable probe design for high bandwidth RF testing

#6 | 2021-01-14

US20210013117A1

Integrated heat spreader (IHS) with heating element

#7 | 2020-05-28

US20200166569A1

X-ray filter

#8 | 2020-03-26

US20200098554A1

Method of sample preparation using dual ion beam trenching

#9 | 2020-01-02

US20200006192A1

Microelectronic assemblies including a thermal interface material

#10 | 2019-09-26

US20190293708A1

Characterization of transmission media

#11 | 2019-07-04

US20190204376A1

Method of resonance analysis for electrical fault isolation

#12 | 2018-11-22

US20180335465A1

High power terahertz impulse for fault isolation

#13 | 2018-10-04

US20180283845A1

WAVELENGTH MODULATABLE INTERFEROMETER

#14 | 2018-09-06

US20180254256A1

Electronic assembly using bismuth-rich solder

#15 | 2017-10-05

US20170284943A1

DETECTING VOIDS AND DELAMINATION IN PHOTORESIST LAYER

#16 | 2017-06-22

US20170176173A1

MEASURING SURFACE LAYER THICKNESS

#17 | 2017-06-15

US20170170080A1

MATERIAL THICKNESS DEVICE AND METHOD

#18 | 2017-04-18

US14757973

Device, system and method for alignment of an integrated circuit assembly

#19 | 2017-03-30

US20170089951A1

Terahertz transmission contactless probing and scanning for signal analysis and fault isolation

#20 | 2016-09-22

US20160274044A1

CIRCUIT DEVICE INSPECTION SYSTEMS USING TEMPERATURE GRADIENTS

#21 | 2016-08-25

US20160245758A1

Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens

#22 | 2016-03-31

US20160093540A1

Inline measurement of molding material thickness using terahertz reflectance

#23 | 2016-01-14

US20160011122A1

Detection of defect in die

#24 | 2015-10-01

US20150276480A1

Non-destructive 3-dimensional chemical imaging of photo-resist material

#25 | 2015-10-01

US20150276375A1

Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens

#26 | 2015-09-10

US20150255414A1

SOLDER ALLOY TO ENHANCE RELIABILITY OF SOLDER INTERCONNECTS WITH NIPDAU OR NIAU SURFACE FINISHES DURING HIGH TEMPERATURE EXPOSURE

#27 | 2007-10-09

US11472640

Electro-optic time domain reflectometry

InventorID:

1284952 ⎘