Inventor profile of:

Sumit AGARWAL

City:

Dublin, California

Country:

United States

Published Applications:

15

Last publication date:

2025-07-31

Top Assignees for applications by Sumit AGARWAL

The entities that hold a legal rights for patent applications filed by inventor AGARWAL Sumit:

Recent patent applications by AGARWAL Sumit

Sumit AGARWAL from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-31
US20250246435A1
Electricity

CRYOGENIC ETCHING OF SILICON-CONTAINING MATERIALS

#2 | 2022-12-15
US20220396857A1
Chemistry; metallurgy

Gas quench for diffusion bonding

#3 | 2022-12-01
US20220380898A1
Chemistry; metallurgy

GAS DISTRIBUTION PLATE WITH HIGH ASPECT RATIO HOLES AND A HIGH HOLE DENSITY

#4 | 2022-10-20
US20220333244A1
Chemistry; metallurgy

Fabrication of a high temperature showerhead

#5 | 2022-04-14
US20220111468A1
Performing operations; transporting

Methods to fabricate chamber component holes using laser drilling

#6 | 2022-04-14
US20220111467A1
Performing operations; transporting

Methods to fabricate chamber component holes using laser drilling

#7 | 2022-02-24
US20220056584A1
Chemistry; metallurgy

Fabricating a recursive flow gas distribution stack using multiple layers

#8 | 2020-10-01
US20200308703A1
Chemistry; metallurgy

Gas distribution plate with high aspect ratio holes and a high hole density

#9 | 2020-09-17
US20200291522A1
Chemistry; metallurgy

Lid assembly apparatus and methods for substrate processing chambers

#10 | 2020-09-10
US20200283900A1
Chemistry; metallurgy

Porous showerhead for a processing chamber

#11 | 2016-04-07
US20160099173A1
Electricity

METHODS FOR ETCHING A BARRIER LAYER FOR AN INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR APPLICATIONS

#12 | 2016-04-07
US20160097131A1
Chemistry; metallurgy

Methods for cyclically etching a metal layer for an interconnection structure for semiconductor applications

#13 | 2016-03-17
US20160079088A1
Electricity

METHOD FOR ETCHING A HARDMASK LAYER FOR AN INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR APPLICATIONS

#14 | 2016-03-17
US20160079077A1
Electricity

Methods for etching a hardmask layer for an interconnection structure for semiconductor applications

#15 | 2015-10-08
US20150287634A1
Electricity

Methods for etching a metal layer to form an interconnection structure for semiconductor applications

InventorID:

1316990 ⎘