Michael John Ries

City:

St. Charles, Missouri

Country:

United States

Published Applications:

Last publication date:

2014-07-03

Top Assignees for applications by Michael John Ries

The entities that hold a legal rights for patent applications filed by inventor Ries Michael John:

MEMC Electronic Materials, Inc. 1 St. Peters, MO United States
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H) 1 Singapore, Singapore
SUNEDISON SEMICONDUCTOR LIMITED 1 Singapore, Singapore

Recent patent applications by Ries Michael John

Michael John Ries from St. Charles, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-07-03

US20140187020A1

Electricity

Method for low temperature layer transfer in the preparation of multilayer semiconductor devices

#2 | 2013-03-14

US20130062020A1

Electricity

Systems and methods for cleaving a bonded wafer pair

#3 | 2005-02-10

US20050032337A1

Electricity

Method and apparatus for forming a silicon wafer with a denuded zone

InventorID:

133411 ⎘