Warstein
Germany
43
2023-08-31
The entities that hold a legal rights for patent applications filed by inventor Hohlfeld Olaf:
Olaf Hohlfeld from Warstein, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for producing a semiconductor arrangement
#2 | 2022-11-10Power semiconductor module arrangement
#3 | 2022-09-29Power module with metal substrate
#4 | 2021-12-30Power module with metal substrate
#5 | 2021-12-23Method for producing a substrate
#6 | 2021-10-28Method for producing power semiconductor module arrangement
#7 | 2021-03-11Semiconductor module and method for producing the same
#8 | 2020-10-08Power semiconductor module and method for fabricating the same
#9 | 2020-08-20Semiconductor arrangement and method for producing the same
#10 | 2020-03-12Power Semiconductor Module Arrangement, Substrate Arrangement, and Method for Producing the Same
#11 | 2019-08-01Power semiconductor module arrangement
#12 | 2019-07-18Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
#13 | 2019-06-20Semiconductor module and method for producing the same
#14 | 2018-12-06An Electronic Device Package
#15 | 2017-10-05Electronic device package having a dielectric layer and an encapsulant
#16 | 2017-05-04Method for producing a power semiconductor module
#17 | 2017-04-06Method for producing a number of chip assemblies and method for producing a semiconductor arrangement
#18 | 2016-12-15Semiconductor module, semiconductor module arrangement and method for operating a semiconductor module
#19 | 2016-09-29Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material
#20 | 2016-05-05Chip assemblage, press pack cell and method for operating a press pack cell
#21 | 2016-05-05Spring contact for semiconductor chip
#22 | 2016-05-05Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
#23 | 2015-10-08Semiconductor assembly comprising chip arrays
#24 | 2015-05-14Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same
#25 | 2015-05-14Semiconductor package comprising two semiconductor modules and laterally extending connectors
#26 | 2015-04-02Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board
#27 | 2015-04-02Explosion-protected semiconductor module
#28 | 2015-03-05Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
#29 | 2015-03-05Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
#30 | 2015-02-26Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement
#31 | 2015-02-26Semiconductor module and a method for fabrication thereof by extended embedding technologies
#32 | 2014-02-06Explosion-protected semiconductor module
#33 | 2013-08-08Method for producing a composite and a power semiconductor module
#34 | 2013-05-30Semiconductor device including cladded base plate
#35 | 2013-03-14Semiconductor device including cladded base plate
#36 | 2012-04-05Semiconductor module comprising an insert
#37 | 2011-03-03Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond
#38 | 2010-12-02Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module
#39 | 2010-11-11Power semiconductor module including substrates spaced from each other
#40 | 2010-11-11Twist-secured assembly of a power semiconductor module mountable on a heat sink
#41 | 2010-10-07Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly
#42 | 2010-03-18MODULE INCLUDING A STABLE SOLDER JOINT
#43 | 2009-10-01Module including a rough solder joint
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