United States
24
2014-10-30
The entities that hold a legal rights for patent applications filed by inventor Infineon Technologies AG:
Infineon Technologies AG from , US has applied for patents for these inventions. The list has both pending applications and granted patents:
Integrated-circuit module with waveguide transition element
#2 | 2014-10-16Semiconductor device with an insulation layer having a varying thickness
#3 | 2014-10-02Leadframe, semiconductor package including a leadframe and method for producing a leadframe
#4 | 2014-09-18SENSOR AND SENSING METHOD
#5 | 2014-09-11Masked nonlinear feedback shift register
#6 | 2014-08-21Device bond pads over process control monitor structures in a semiconductor die
#7 | 2014-07-31Compatible network node, in particular, for can bus systems
#8 | 2014-05-29Charge conservation in pixels
#9 | 2014-03-06PSEUDO RANDOM NUMBER GENERATOR AND METHOD FOR PROVIDING A PSEUDO RANDOM SEQUENCE
#10 | 2013-11-14Current sensor
#11 | 2013-08-29Passivated copper chip pads
#12 | 2013-08-29Methods of fabricating semiconductor devices and structures thereof
#13 | 2013-08-29Lateral trench transistor, as well as a method for its production
#14 | 2013-08-29Method and system for compensating a delay mismatch between a first measurement channel and a second measurement channel
#15 | 2013-08-29Power semiconductor module system with undercut connection
#16 | 2013-08-29Semiconductor devices and methods of manufacture thereof
#17 | 2013-08-22Rotation angle sensor for absolute rotation angle determination even upon multiple revolutions
#18 | 2013-08-22Method of fabricating semiconductor cleaners
#19 | 2013-08-22Transistor device and method of manufacture thereof
#20 | 2013-08-22Virtual analog to digital converter
#21 | 2013-08-22METHOD AND APPARATUS FOR REDUCING FLICKER NOISE IN A SEMICONDUCTOR DEVICE
#22 | 2013-08-15Adjustable impedance matching network
#23 | 2013-08-15Integrated antennas in wafer level package
#24 | 2013-03-14Semiconductor structure and method for making same
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