Thornhill
Canada
15
2015-10-01
The entities that hold a legal rights for patent applications filed by inventor Low Yip Seng:
Yip Seng Low from Thornhill, CA has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor chip with patterned underbump metallization and polymer film
#2 | 2013-10-03SEMICONDUCTOR CHIP DEVICE WITH VENTED LID
#3 | 2013-06-13HEATSINK INTERPOSER
#4 | 2013-06-13Circuit board component shim structure
#5 | 2013-05-09SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER
#6 | 2013-03-14Solder mask with anchor structures
#7 | 2012-05-17CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME
#8 | 2011-09-22Method of manufacturing substrates having asymmetric buildup layers
#9 | 2011-06-23Circuit board with via trace connection and method of making the same
#10 | 2011-06-09Conductor bump method and apparatus
#11 | 2011-03-10Semiconductor Chip with Stair Arrangement Bump Structures
#12 | 2011-02-03METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS
#13 | 2010-06-24Face-to-face (F2F) hybrid structure for an integrated circuit
#14 | 2010-04-29Hybrid Semiconductor Chip Package
#15 | 2009-02-05Conductor bump method and apparatus
134876 ⎘