Muenchen
Germany
10
2025-03-27
The entities that hold a legal rights for patent applications filed by inventor PEDONE Daniel:
Daniel PEDONE from Muenchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICALLY AND MECHANICALLY COUPLING FIRST AND SECOND POWER SEMICONDUCTOR CHIPS TO A LEADFRAME PART AND METHOD FOR FABRICATING THEA SEMICONDUCTOR PACKAGE
#2 | 2024-03-21Method for Fabricating a Power Semiconductor Device
#3 | 2023-12-21SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
#4 | 2023-09-14Semiconductor package and method for fabricating a semiconductor package
#5 | 2022-05-12Linear spacer for spacing a carrier of a package
#6 | 2021-09-30Method for processing a semiconductor wafer, semiconductor wafer, clip and semiconductor device
#7 | 2021-07-22Power Semiconductor Device and Method for Fabricating a Power Semiconductor Device
#8 | 2021-05-06Semiconductor package and method for fabricating a semiconductor package
#9 | 2016-04-21Insulated gate bipolar transistor comprising negative temperature coefficient thermistor
#10 | 2015-11-12Method for processing a semiconductor workpiece and semiconductor workpiece
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