Inventor profile of:

King Owyang

City:

Atherton, California

Country:

United States

Published Applications:

14

Last publication date:

2017-01-26

Top Assignees for applications by King Owyang

The entities that hold a legal rights for patent applications filed by inventor Owyang King:

Recent patent applications by Owyang King

King Owyang from Atherton, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-01-26
US20170025527A1
Electricity

Semiconductor device with trench-like feed-throughs

#2 | 2015-11-19
US20150331438A1
Physics

COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MOUNT PACKAGE

#3 | 2011-05-05
US20110101525A1
Electricity

Semiconductor device with trench-like feed-throughs

#4 | 2010-09-02
US20100219519A1
Physics

Complete power management system implemented in a single surface mount package

#5 | 2009-11-12
US20090278176A1
Electricity

High current density power field effect transistor

#6 | 2009-10-15
US20090256246A1
Electricity

Semiconductor including cup-shaped leadframe packaging techniques

#7 | 2009-09-29
US11151749
-

Semiconductor die package including cup-shaped leadframe

#8 | 2007-03-22
US20070063341A1
Physics

Complete power management system implemented in a single surface mount package

#9 | 2007-03-22
US20070063340A1
Physics

Complete power management system implemented in a single surface mount package

#10 | 2006-05-25
US20060110856A1
Electricity

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

#11 | 2006-05-25
US20060108671A1
Electricity

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

#12 | 2006-04-25
US10326311
-

Trench MIS device having implanted drain-drift region and thick bottom oxide and process for manufacturing the same

#13 | 2005-10-27
US20050236665A1
Electricity

Trench MIS device having implanted drain-drift region and thick bottom oxide

#14 | 2005-06-21
US10291153
-

Semiconductor assembly with package using cup-shaped lead-frame

InventorID:

1362361 ⎘