Kenya Kai

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2023-03-02

Top Assignees for applications by Kenya Kai

The entities that hold a legal rights for patent applications filed by inventor Kai Kenya:

Kenya Kai from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer processing method and wafer processing apparatus

Wafer processing method and wafer processing apparatus

Saw device manufacturing method

Method of manufacturing substrate for acoustic wave device

Grinding apparatus

Wafer processing method to remove crystal strains

InventorID:

1363770 ⎘