Cupertino, California
United States
26
2023-11-02
The entities that hold a legal rights for patent applications filed by inventor Li Ming:
Ming Li from Cupertino, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Artificial intelligent enhanced data sampling
#2 | 2021-01-28Artificial intelligent enhanced data sampling
#3 | 2018-11-01Packet batch processing with graph-path based pre-classification
#4 | 2018-03-08Laser bleach marking of an anodized surface
#5 | 2016-02-25Automatic division of internet protocol radio access networks to interior gateway protocol areas
#6 | 2015-01-01Multiprotocol Label Switching Transport for Supporting a Very Large Number of Virtual Private Networks
#7 | 2014-09-18Methods of representing software defined networking-based multiple layer network topology views
#8 | 2014-04-10In-service software patch
#9 | 2013-03-14Apparatus and system for packet routing and forwarding in an interior network
#10 | 2012-12-20Deposition of thin film dielectrics and light emitting nano-layer structures
#11 | 2012-08-16Method for dynamic migration of a process or services from one control plane processor to another
#12 | 2012-07-12Method for group-based multicast with non-uniform receivers
#13 | 2012-05-31Method for dynamic on demand startup of a process or resource
#14 | 2012-05-31Method For Dynamic Discovery of Control Plane Resources and Services
#15 | 2010-11-30Detection and recovery from control plane congestion and faults
#16 | 2010-10-28Determining the group address for an Ethernet-based multicast communication
#17 | 2010-10-28Implementation to avoid the acknowledgement-implosion in a multicast group
#18 | 2010-04-08User tolerance based scheduling method for aperiodic real-time tasks
#19 | 2008-12-11Tungsten nitride atomic layer deposition processes
#20 | 2008-10-09METHOD OF POLY-SILICON GRAIN STRUCTURE FORMATION
#21 | 2007-12-13Deposition of nano-crystal silicon using a single wafer chamber
#22 | 2007-01-25Tungsten nitride atomic layer deposition processes
#23 | 2006-10-05Single wafer thermal CVD processes for hemispherical grained silicon and nano-crystalline grain-sized polysilicon
#24 | 2006-02-02Thin tungsten silicide layer deposition and gate metal integration
#25 | 2006-01-26Deposition of nano-crystal silicon using a single wafer chamber
#26 | 2005-08-11Cyclical deposition of tungsten nitride for metal oxide gate electrode
137229 ⎘