Inventor profile of:

Thomas Buschhardt

City:

Burghausen

Country:

Germany

Published Applications:

18

Last publication date:

2020-03-19

Top Assignees for applications by Thomas Buschhardt

The entities that hold a legal rights for patent applications filed by inventor Buschhardt Thomas:

Recent patent applications by Buschhardt Thomas

Thomas Buschhardt from Burghausen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-03-19
US20200086348A1
Performing operations; transporting

Separating apparatus for polysilicon

#2 | 2018-07-05
US20180185882A1
Performing operations; transporting

Screen plate for screening plants for mechanical classification of polysilicon

#3 | 2013-07-25
US20130189904A1
Performing operations; transporting

Method for polishing a semiconductor wafer

#4 | 2013-03-21
US20130068262A1
Performing operations; transporting

Method for the treatment of a semiconductor wafer

#5 | 2012-10-04
US20120248068A1
Electricity

Process Module for the Inline-Treatment of Substrates

#6 | 2011-10-06
US20110244762A1
Electricity

Method for the double-side polishing of a semiconductor wafer

#7 | 2011-04-28
US20110097975A1
Performing operations; transporting

Method for producing a semiconductor wafer

#8 | 2011-04-28
US20110097974A1
Performing operations; transporting

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

#9 | 2010-11-18
US20100291761A1
Electricity

Method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front side

#10 | 2010-06-10
US20100139706A1
Performing operations; transporting

Method for the treatment of a semiconductor wafer

#11 | 2009-06-11
US20090145457A1
Electricity

Method for the wet-chemical treatment of a semiconductor wafer

#12 | 2009-03-19
US20090071507A1
Chemistry; metallurgy

PROCESS FOR CLEANING A SEMICONDUCTOR WAFER

#13 | 2009-01-29
US20090029552A1
Chemistry; metallurgy

Method for polishing a substrate composed of semiconductor material

#14 | 2009-01-08
US20090007940A1
Chemistry; metallurgy

Process for cleaning a semiconductor wafer using a cleaning solution

#15 | 2008-12-18
US20080308122A1
Electricity

Process for cleaning, drying and hydrophilizing a semiconductor wafer

#16 | 2008-10-30
US20080265375A1
Electricity

Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx Layer

#17 | 2007-11-08
US20070259530A1
Electricity

Method for producing a layer structure

#18 | 2007-01-25
US20070021042A1
Performing operations; transporting

Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method

InventorID:

146050 ⎘