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Inventor profile of:

Su-hee CHAE

City:

Suwon-si

Country:

South Korea

Published Applications:

Last publication date:

2015-04-23

Top Assignees for applications by Su-hee CHAE

The entities that hold a legal rights for patent applications filed by inventor CHAE Su-hee:

SAMSUNG ELECTRONICS CO., LTD. 15 Gyeonggi-Do, South Korea
SAMSUNG ELECTRONICS CO., LTD. 13 Suwon-si, South Korea
SAMSUNG ELECTRONICS CO. LTD. 1 Suwon-si, Gyeonggi-do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon-si, South Korea
Samsung Led Co., Ltd. 1 Gyeonggi-do, South Korea

Recent patent applications by CHAE Su-hee

Su-hee CHAE from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-04-23

US20150111369A1

Electricity

Semiconductor buffer structure, semiconductor device including the semiconductor buffer structure, and method of manufacturing the semiconductor device using the semiconductor buffer structure

#2 | 2015-04-02

US20150093848A1

Electricity

Semiconductor light emitting devices having an uneven emission pattern layer and methods of manufacturing the same

#3 | 2014-05-08

US20140124818A1

Electricity

Light emitting device

#4 | 2014-04-24

US20140113437A1

Electricity

Substrate structure and method of manufacturing the same

#5 | 2014-02-27

US20140057381A1

Electricity

Vertical light-emitting devices having patterned emitting unit and methods of manufacturing the same

#6 | 2014-01-16

US20140014990A1

Electricity

LIGHT-EMITTING DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

#7 | 2013-06-06

US20130140567A1

Chemistry; metallurgy

Silicon substrate including an edge portion, epitaxial structure including the same, and method of manufacturing the silicon substrate

#8 | 2013-06-06

US20130139966A1

Electricity

JIG FOR USE IN ETCHING AND CHEMICAL LIFT-OFF APPARATUS INCLUDING THE SAME

#9 | 2013-03-21

US20130069074A1

Electricity

POWER DEVICE AND METHOD OF MANUFACTURING THE SAME

#10 | 2012-07-12

US20120175662A1

Electricity

Vertical light emitting device

#11 | 2012-06-21

US20120153261A1

Electricity

Semiconductor device and method of manufacturing the same

#12 | 2012-01-26

US20120018734A1

Electricity

Semiconductor light emitting devices having an uneven emission pattern layer and methods of manufacturing the same

#13 | 2012-01-12

US20120007143A1

Electricity

Substrate structure and method of manufacturing the same

#14 | 2011-12-08

US20110300654A1

Electricity

Method of manufacturing semiconductor light emitting device

#15 | 2011-12-01

US20110291120A1

Electricity

Light Emitting Devices Using Connection Structures And Methods Of Manufacturing The Same

#16 | 2011-11-10

US20110272712A1

Electricity

Vertical light-emitting devices having patterned emitting unit and methods of manufacturing the same

#17 | 2011-06-02

US20110127489A1

Electricity

Light emitting device and method of manufacturing the same

#18 | 2010-05-20

US20100124798A1

Electricity

Method of manufacturing light emitting device

#19 | 2010-05-20

US20100123158A1

Electricity

Light emitting device and method of manufacturing the same

#20 | 2008-05-01

US20080102549A1

Electricity

Method of manufacturing semiconductor light emitting device

#21 | 2006-11-09

US20060249745A1

Electricity

Heat dissipating structure and light emitting device having the same

#22 | 2006-11-09

US20060249744A1

Electricity

Submount for light emitting device

#23 | 2006-06-29

US20060138444A1

Electricity

Flip-chip bonding structure of light-emitting element using metal column

InventorID:

147667 ⎘