Inventor profile of:

Kai Liu

City:

Phoenix, Arizona

Country:

United States

Published Applications:

51

Last publication date:

2025-01-30

Top Assignees for applications by Kai Liu

The entities that hold a legal rights for patent applications filed by inventor Liu Kai:

Recent patent applications by Liu Kai

Kai Liu from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-30
US20250037923A1
Electricity

PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER

#2 | 2025-01-16
US20250022858A1
Electricity

DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS

#3 | 2025-01-02
US20250006631A1
Electricity

INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER

#4 | 2024-11-21
US20240387092A1
Electricity

INDUCTIVE DEVICE

#5 | 2024-09-26
US20240322417A1
Electricity

Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit package

#6 | 2024-09-26
US20240321507A1
Electricity

THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES

#7 | 2024-09-12
US20240304545A1
Electricity

COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-LEVEL PROCESS

#8 | 2024-08-01
US20240258995A1
Electricity

COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE

#9 | 2024-08-01
US20240258363A1
Electricity

INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL

#10 | 2024-06-20
US20240204039A1
Electricity

DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE INDUCTOR

#11 | 2024-03-28
US20240105760A1
Electricity

INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD

#12 | 2024-02-01
US20240038439A1
Electricity

INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS

#13 | 2024-01-18
US20240021353A1
Electricity

THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS

#14 | 2024-01-04
US20240006308A1
Electricity

INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC MATERIAL

#15 | 2023-12-07
US20230395491A1
Electricity

Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter design

#16 | 2023-09-28
US20230307355A1
Electricity

Integrated device and integrated passive device comprising magnetic material

#17 | 2023-08-31
US20230275004A1
Electricity

CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER

#18 | 2023-04-20
US20230121565A1
Electricity

Backend and acoustic process integration for high-Q filter

#19 | 2022-12-22
US20220406288A1
Physics

High harmonic performance radio frequency filter

#20 | 2021-08-19
US20210257989A1
Electricity

Wideband filter with resonators and inductors

#21 | 2021-02-25
US20210057404A1
Electricity

ON-DIE ELECTROSTATIC DISCHARGE PROTECTION

#22 | 2018-01-11
US20180012851A1
Electricity

Antenna in embedded wafer-level ball-grid array package

#23 | 2017-02-02
US20170033062A1
Electricity

Antenna in embedded wafer-level ball-grid array package

#24 | 2014-03-27
US20140084415A1
Electricity

Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer

#25 | 2014-01-02
US20140002207A1
Electricity

Semiconductor device having balanced band-pass filter implemented with LC resonators

#26 | 2013-09-26
US20130248859A1
Physics

Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration

#27 | 2013-04-25
US20130099356A1
Electricity

Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing

#28 | 2013-03-21
US20130069197A1
Electricity

Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate

#29 | 2012-12-20
US20120319302A1
Electricity

Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor package

#30 | 2012-11-29
US20120299151A1
Electricity

Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR

#31 | 2012-10-25
US20120267800A1
Electricity

Semiconductor device and method of forming IPD in fan-out wafer level chip scale package

#32 | 2012-06-28
US20120161279A1
Electricity

Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer

#33 | 2011-12-22
US20110309892A1
Electricity

Semiconductor device and method of integrating balun and RF coupler on a common substrate

#34 | 2011-12-15
US20110304012A1
Electricity

Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate

#35 | 2011-10-06
US20110241793A1
Electricity

Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR

#36 | 2011-10-06
US20110241163A1
Electricity

Semiconductor device and method of forming high-attenuation balanced band-pass filter

#37 | 2011-08-25
US20110204509A1
Electricity

Semiconductor device and method of forming IPD in fan-out level chip scale package

#38 | 2011-03-10
US20110057742A1
Electricity

Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing

#39 | 2010-09-16
US20100231317A1
Electricity

Semiconductor device and method of integrating balun and RF coupler on a common substrate

#40 | 2010-06-10
US20100140742A1
Electricity

Semiconductor device and method of forming thin film capacitor

#41 | 2010-06-10
US20100140738A1
Electricity

Semiconductor device and method of forming compact coils for high performance filter

#42 | 2010-02-25
US20100045398A1
Electricity

Miniaturized wide-band baluns for RF applications

#43 | 2010-02-18
US20100039185A1
Electricity

Miniaturized wide-band baluns for RF applications

#44 | 2010-02-11
US20100033290A1
Electricity

Miniaturized wide-band baluns for RF applications

#45 | 2010-02-11
US20100033289A1
Electricity

Miniaturized wide-band baluns for RF applications

#46 | 2010-01-07
US20100001268A1
Electricity

Semiconductor device and method of shunt test measurement for passive circuits

#47 | 2009-09-10
US20090224361A1
Electricity

Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD

#48 | 2009-07-02
US20090167455A1
Electricity

Semiconductor device having balanced band-pass filter implemented with LC resonator

#49 | 2008-12-11
US20080303606A1
Electricity

Miniaturized wide-band baluns for RF applications

#50 | 2008-10-16
US20080252395A1
Electricity

Compact coils for high performance filters

#51 | 2006-07-06
US20060145782A1
Electricity

Multiplexers employing bandpass-filter architectures

InventorID:

147876 ⎘