Phoenix, Arizona
United States
51
2025-01-30
The entities that hold a legal rights for patent applications filed by inventor Liu Kai:
Kai Liu from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER
#2 | 2025-01-16DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS
#3 | 2025-01-02INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER
#4 | 2024-11-21INDUCTIVE DEVICE
#5 | 2024-09-26Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit package
#6 | 2024-09-26THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
#7 | 2024-09-12COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-LEVEL PROCESS
#8 | 2024-08-01COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE
#9 | 2024-08-01INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL
#10 | 2024-06-20DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE INDUCTOR
#11 | 2024-03-28INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
#12 | 2024-02-01INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
#13 | 2024-01-18THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS
#14 | 2024-01-04INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC MATERIAL
#15 | 2023-12-07Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter design
#16 | 2023-09-28Integrated device and integrated passive device comprising magnetic material
#17 | 2023-08-31CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER
#18 | 2023-04-20Backend and acoustic process integration for high-Q filter
#19 | 2022-12-22High harmonic performance radio frequency filter
#20 | 2021-08-19Wideband filter with resonators and inductors
#21 | 2021-02-25ON-DIE ELECTROSTATIC DISCHARGE PROTECTION
#22 | 2018-01-11Antenna in embedded wafer-level ball-grid array package
#23 | 2017-02-02Antenna in embedded wafer-level ball-grid array package
#24 | 2014-03-27Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer
#25 | 2014-01-02Semiconductor device having balanced band-pass filter implemented with LC resonators
#26 | 2013-09-26Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration
#27 | 2013-04-25Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
#28 | 2013-03-21Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate
#29 | 2012-12-20Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor package
#30 | 2012-11-29Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR
#31 | 2012-10-25Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
#32 | 2012-06-28Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer
#33 | 2011-12-22Semiconductor device and method of integrating balun and RF coupler on a common substrate
#34 | 2011-12-15Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate
#35 | 2011-10-06Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR
#36 | 2011-10-06Semiconductor device and method of forming high-attenuation balanced band-pass filter
#37 | 2011-08-25Semiconductor device and method of forming IPD in fan-out level chip scale package
#38 | 2011-03-10Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
#39 | 2010-09-16Semiconductor device and method of integrating balun and RF coupler on a common substrate
#40 | 2010-06-10Semiconductor device and method of forming thin film capacitor
#41 | 2010-06-10Semiconductor device and method of forming compact coils for high performance filter
#42 | 2010-02-25Miniaturized wide-band baluns for RF applications
#43 | 2010-02-18Miniaturized wide-band baluns for RF applications
#44 | 2010-02-11Miniaturized wide-band baluns for RF applications
#45 | 2010-02-11Miniaturized wide-band baluns for RF applications
#46 | 2010-01-07Semiconductor device and method of shunt test measurement for passive circuits
#47 | 2009-09-10Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD
#48 | 2009-07-02Semiconductor device having balanced band-pass filter implemented with LC resonator
#49 | 2008-12-11Miniaturized wide-band baluns for RF applications
#50 | 2008-10-16Compact coils for high performance filters
#51 | 2006-07-06Multiplexers employing bandpass-filter architectures
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