Muenchen
Germany
39
2022-05-12
The entities that hold a legal rights for patent applications filed by inventor Meyer-Berg Georg:
Georg Meyer-Berg from Muenchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
#2 | 2019-09-19Chip package with cross-linked thermoplastic dielectric
#3 | 2017-08-17Semiconductor device including an antenna
#4 | 2017-08-03Attaching chip attach medium to already encapsulated electronic chip
#5 | 2016-12-08Arrangement of multiple power semiconductor chips and method of manufacturing the same
#6 | 2016-07-28Device comprising a ductile layer and method of making the same
#7 | 2016-05-05Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
#8 | 2015-02-19CHIP ARRANGEMENT
#9 | 2015-01-01Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery
#10 | 2014-12-04Packaged semiconductor device having an embedded system
#11 | 2014-09-18Chip arrangement and a method of manufacturing a chip arrangement
#12 | 2014-06-05Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
#13 | 2014-05-29Device comprising a ductile layer and method of making the same
#14 | 2014-05-22Method for fabricating an electronic component
#15 | 2014-05-22Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
#16 | 2014-05-08Packaged nano-structured component and method of making a packaged nano-structured component
#17 | 2014-05-01Semiconductor device with encapsulant
#18 | 2014-01-30Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#19 | 2014-01-23Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
#20 | 2013-12-19Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
#21 | 2013-05-16Sensor device and method
#22 | 2013-04-25Semiconductor device and method
#23 | 2013-04-11ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
#24 | 2013-04-04Integrated circuit package and a method for manufacturing an integrated circuit package
#25 | 2013-03-21Device including a semiconductor chip and metal foils
#26 | 2012-11-15Integrated circuit package and packaging methods
#27 | 2012-11-15Integrated circuit package and packaging methods
#28 | 2012-10-18Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil
#29 | 2012-09-13DEVICE INCLUDING A SEMICONDUCTOR CHIP
#30 | 2012-05-24Sensor device having a structure element
#31 | 2012-03-15Die structure, die arrangement and method of processing a die
#32 | 2011-12-08Semiconductor package with integrated inductor
#33 | 2011-08-11Manufacturing of a device including a semiconductor chip
#34 | 2010-09-16Sensor device having a porous structure element
#35 | 2010-08-19Electronic Device and Method of Manufacturing Same
#36 | 2010-06-03Device including a semiconductor chip and metal foils
#37 | 2010-05-27Device including a semiconductor chip
#38 | 2008-08-14SYSTEM FOR DISTRIBUTING ELECTRICAL POWER FOR A CHIP
#39 | 2007-04-12Semiconductor module having a coupling substrate, and methods for its production
147901 ⎘