Holger Ulrich

City:

Eisendorf

Country:

Germany

Published Applications:

Last publication date:

2021-04-08

Top Assignees for applications by Holger Ulrich

The entities that hold a legal rights for patent applications filed by inventor Ulrich Holger:

DANFOSS SILICON POWER GMBH 9 Flensburg, Germany

Recent patent applications by Ulrich Holger

Holger Ulrich from Eisendorf, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-04-08

US20210104488A1

Electricity

Process and device for low-temperature pressure sintering

#2 | 2021-01-21

US20210016353A1

Performing operations; transporting

Sintering tool and method for sintering an electronic subassembly

#3 | 2018-08-23

US20180240776A1

Electricity

Method for manufacturing semiconductor chips

#4 | 2018-08-02

US20180218957A1

Electricity

Power semiconductor module

#5 | 2017-11-02

US20170317051A1

Electricity

Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module

#6 | 2017-08-10

US20170229424A1

Electricity

Process and device for low-temperature pressure sintering

#7 | 2017-08-10

US20170229418A1

Electricity

Sintering device

#8 | 2017-08-03

US20170221852A1

Electricity

Sintering tool for the lower die of a sintering device

#9 | 2017-08-03

US20170216920A1

Performing operations; transporting

Sintering tool and method for sintering an electronic subassembly

#10 | 2016-04-21

US20160109190A1

Mechanical engineering

A FLOW DISTRIBUTION MODULE WITH A PATTERNED COVER PLATE

InventorID:

1505784 ⎘