Flensburg
Germany
40
2024-09-26
40
2026-06-16
These are the the leading inventors for applications assigned to DANFOSS SILICON POWER GMBH:
DANFOSS SILICON POWER GMBH based in Flensburg, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
PRESSURE-SINTERING METHOD EMPLOYING DEFORMATION UPTAKE MEANS
#2 | 2024-07-11 ✅ Patent 12,620,907 granted on 2026-05-05CONDUCTOR STRUCTURE
#3 | 2024-06-27 ✅ Patent 12,635,522 granted on 2026-05-19ELECTRONIC COMPONENT COOLER
#4 | 2023-08-10 ✅ Patent 12,627,290 granted on 2026-05-12SWITCHING COMPONENTS
#5 | 2023-04-20 ✅ Patent 12,424,512 granted on 2025-09-23COOLING SYSTEM COMPRISING A SERPENTINE PASSAGEWAY
#6 | 2023-04-13 ✅ Patent 12,444,670 granted on 2025-10-14POWER MODULE
#7 | 2022-10-27 ✅ Patent 12,046,584 granted on 2024-07-23Semiconductor module
#8 | 2022-10-06 ✅ Patent 12,261,543 granted on 2025-03-25Three-level power module
#9 | 2022-09-22 ✅ Patent 12,125,817 granted on 2024-10-22Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other
#10 | 2022-09-22 ✅ Patent 12,581,983 granted on 2026-03-17SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR
#11 | 2022-09-15 ✅ Patent 12,133,366 granted on 2024-10-29Power electronics module with improved cooling
#12 | 2022-09-15 ✅ Patent 12,136,585 granted on 2024-11-05Compact power electronics module with increased cooling surface
#13 | 2022-07-07 ✅ Patent 12,087,699 granted on 2024-09-10Semiconductor module
#14 | 2022-05-19 ✅ Patent 12,046,576 granted on 2024-07-23Pressure sintering device and method for manufacturing an electronic component
#15 | 2022-03-03 ✅ Patent 12,621,969 granted on 2026-05-05ELECTRONIC POWER SYSTEM AND METHOD FOR MANUFACTURING THE SAME
#16 | 2021-04-08 ✅ Patent 11,626,383 granted on 2023-04-11Process and device for low-temperature pressure sintering
#17 | 2021-01-21 ✅ Patent 11,400,514 granted on 2022-08-02Sintering tool and method for sintering an electronic subassembly
#18 | 2021-01-14 ✅ Patent 11,894,302 granted on 2024-02-06Semiconductor power module with busbar having a leg with a foot forming an offset angle, and method for manufacturing the busbar
#19 | 2020-11-26 ✅ Patent 10,910,296 granted on 2021-02-02Lead frame and method of fabricating the same
#20 | 2020-11-19 ✅ Patent 11,532,600 granted on 2022-12-20Semiconductor module
#21 | 2020-07-23 ✅ Patent 11,616,353 granted on 2023-03-28Busbar and power module
#22 | 2020-06-11 ✅ Patent 11,134,587 granted on 2021-09-28Power module with integrated cooling device
#23 | 2019-12-05 ✅ Patent 10,999,955 granted on 2021-05-04Electronic power system and method for manufacturing the same
#24 | 2019-11-07 ✅ Patent 10,832,995 granted on 2020-11-10Power module
#25 | 2019-08-15 ✅ Patent 10,794,390 granted on 2020-10-06Modular turbo compressor shaft
#26 | 2018-11-15 ✅ Patent 10,332,858 granted on 2019-06-25Electronic sandwich structure with two parts joined together by means of a sintering layer
#27 | 2018-08-23 ✅ Patent 10,607,962 granted on 2020-03-31Method for manufacturing semiconductor chips
#28 | 2018-08-02 ✅ Patent 10,381,283 granted on 2019-08-13Power semiconductor module
#29 | 2018-01-11 ✅ Patent 10,796,985 granted on 2020-10-06Lead frame and method of fabricating the same
#30 | 2017-12-21 ✅ Patent 10,403,566 granted on 2019-09-03Power module
#31 | 2017-11-16 ✅ Patent 10,306,800 granted on 2019-05-28Cooling trough, cooler and power module assembly
#32 | 2017-11-02 ✅ Patent 10,438,924 granted on 2019-10-08Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module
#33 | 2017-11-02 ✅ Patent 10,079,219 granted on 2018-09-18Power semiconductor contact structure and method for the production thereof
#34 | 2017-08-10 ✅ Patent 11,776,932 granted on 2023-10-03Process and device for low-temperature pressure sintering
#35 | 2017-08-10 ✅ Patent 10,483,229 granted on 2019-11-19Sintering device
#36 | 2017-08-03 ✅ Patent 10,818,633 granted on 2020-10-27Sintering tool for the lower die of a sintering device
#37 | 2017-08-03 ✅ Patent 10,814,396 granted on 2020-10-27Sintering tool and method for sintering an electronic subassembly
#38 | 2016-08-04 ✅ Patent 9,613,929 granted on 2017-04-04Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#39 | 2014-08-21 ✅ Patent 9,786,627 granted on 2017-10-10Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#40 | 2014-08-14 ✅ Patent 9,318,421 granted on 2016-04-19Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
Also check out DANFOSS SILICON POWER GMBH's (Flensburg, Germany) applicant profile with 46 patent applications submitted.
74454 ⎘