Tokyo
Japan
14
2026-04-30
The entities that hold a legal rights for patent applications filed by inventor OYA Daisuke:
Daisuke OYA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
#2 | 2024-09-05Power semiconductor device
#3 | 2022-11-10SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#4 | 2022-05-26Integrally bonded semiconductor device and power converter including the same
#5 | 2022-02-03Aluminum/ceramic bonding substrate and method for producing same
#6 | 2021-07-15Semiconductor device including a groove within a resin insulating part positioned between and covering parts of a first electrode and a second electrode
#7 | 2021-04-29Semiconductor-mounting heat dissipation base plate and production method therefor
#8 | 2019-11-14METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF
#9 | 2019-08-08Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion
#10 | 2019-07-04Semiconductor device
#11 | 2019-04-18Semiconductor-mounting heat dissipation base plate and production method therefor
#12 | 2018-10-04Semiconductor module
#13 | 2018-08-30Semiconductor device including a cylindrical electrode inserted into a looped portion of an electrode
#14 | 2016-04-21Semiconductor device
1509012 ⎘