Tokyo
Japan
99
2026-04-30
76
2025-12-16
These are the the leading inventors for applications assigned to Dowa Metaltech Co., LTD.:
Dowa Metaltech Co., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
#2 | 2026-04-09COMPOSITE MATERIAL, TERMINAL AND METHOD FOR MANUFACTURING TERMINAL
#3 | 2026-02-26SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
#4 | 2025-12-18COMPOSITE MATERIAL, METHOD FOR PRODUCING THE COMPOSITE MATERIAL, AND TERMINAL
#5 | 2025-09-04COMPOSITE MATERIAL, METHOD FOR PRODUCING THE COMPOSITE MATERIAL, AND TERMINAL
#6 | 2025-07-17SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
#7 | 2025-06-05COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#8 | 2025-06-05COMPOSITE MATERIAL, METHOD FOR PRODUCING THE COMPOSITE MATERIAL, AND TERMINAL
#9 | 2025-05-29COPPER-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#10 | 2025-03-20SELECTIVE PLATING MASK MEMBER AND SELECTIVE PLATING METHOD
#11 | 2025-01-30COMPOSITE MATERIAL, METHOD FOR PRODUCING THE COMPOSITE MATERIAL, AND TERMINAL
#12 | 2024-11-28METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
#13 | 2024-08-29COMPOSITE MATERIAL, METHOD FOR MANUFACTURING COMPOSITE MATERIAL, TERMINAL AND METHOD FOR MANUFACTURING TERMINAL
#14 | 2024-08-29SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
#15 | 2024-07-11ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#16 | 2024-06-20COPPER ALLOY SHEET MATERIAL AND METHOD FOR PRODUCING THE COPPER ALLOY SHEET MATERIAL
#17 | 2024-04-25ALUMINUM-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#18 | 2024-01-25 β Patent 12,497,707 granted on 2025-12-16AG-PLATED MATERIAL, METHOD FOR PRODUCING AG-PLATED MATERIAL, AND ELECTRICAL COMPONENT
#19 | 2024-01-18AG-COATED MATERIAL, METHOD FOR PRODUCING AG-COATED MATERIAL, AND TERMINAL COMPONENT
#20 | 2023-10-05 β Patent 12,203,189 granted on 2025-01-21Silver-plated product and method for producing same
#21 | 2023-10-05 β Patent 11,946,127 granted on 2024-04-02CuβTi-based copper alloy sheet material, method for producing the same, electric current carrying component, and heat radiation component
#22 | 2023-09-21INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
#23 | 2023-08-24 β Patent 12,610,816 granted on 2026-04-21INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
#24 | 2023-06-08 β Patent 12,516,435 granted on 2026-01-06COMPOSITE MATERIAL, METHOD FOR PRODUCING COMPOSITE MATERIAL, AND TERMINAL
#25 | 2023-05-11SILVER-PLATED MEMBER, METHOD FOR PRODUCING THE SAME, AND TERMINAL COMPONENT
#26 | 2023-03-30 β Patent 12,297,556 granted on 2025-05-13Silver-plated product and method for producing same
#27 | 2023-03-23 β Patent 12,173,425 granted on 2024-12-24Silver-plated product and method for producing same
#28 | 2023-03-02 β Patent 12,337,421 granted on 2025-06-24BRAZING MATERIAL, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRODUCING METAL-CERAMICS BONDED SUBSTRATE
#29 | 2023-02-16 β Patent 11,926,917 granted on 2024-03-12Composite plating material and method for producing the same
#30 | 2023-01-19 β Patent 12,134,814 granted on 2024-11-05CuβNiβSi-based copper alloy sheet material, method for producing same, and current-carrying component
#31 | 2022-11-17 β Patent 12,300,512 granted on 2025-05-13Metal/ceramic bonding substrate and method for producing same
#32 | 2022-08-18 β Patent 11,920,255 granted on 2024-03-05Composite plated product and method for producing same
#33 | 2022-05-26 β Patent 12,049,690 granted on 2024-07-30Copper alloy plate and method for producing same
#34 | 2022-05-05 β Patent 11,761,108 granted on 2023-09-19Method for producing insulated circuit board using a mask and partial plating method using the mask
#35 | 2022-05-05 β Patent 11,898,263 granted on 2024-02-13Plated product and method for producing same
#36 | 2022-03-17 β Patent 11,919,288 granted on 2024-03-05Method for producing heat radiation member
#37 | 2022-02-03 β Patent 12,221,389 granted on 2025-02-11Aluminum/ceramic bonding substrate and method for producing same
#38 | 2022-02-03 β Patent 12,145,352 granted on 2024-11-19Metal/ceramic bonding substrate and method for producing same
#39 | 2021-08-05 β Patent 11,946,129 granted on 2024-04-02CuβNiβAl based copper alloy sheet material, method for producing same, and conductive spring member
#40 | 2020-12-31 β Patent 11,591,673 granted on 2023-02-28Copper alloy plate and method for producing same
#41 | 2020-09-24 β Patent 11,208,730 granted on 2021-12-28Composite plated product and method for producing same
#42 | 2020-07-23 β Patent 11,225,726 granted on 2022-01-18Composite plated product and method for producing same
#43 | 2020-05-07 β Patent 11,332,815 granted on 2022-05-17CuβCoβSi-based copper alloy sheet material and method for producing the same, and component using the sheet material
#44 | 2020-03-12ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
#45 | 2020-03-05 β Patent 10,985,485 granted on 2021-04-20Tin-plated product and method for producing same
#46 | 2020-02-27 β Patent 11,162,745 granted on 2021-11-02Heat radiating plate and method for producing same
#47 | 2020-02-13 β Patent 11,142,839 granted on 2021-10-12Silver-plated product and method for producing same
#48 | 2019-08-29 β Patent 11,293,084 granted on 2022-04-05Sheet matertal of copper alloy and method for producing same
#49 | 2019-05-09 β Patent 10,982,345 granted on 2021-04-20Tin-plated product and method for producing same
#50 | 2019-04-11 β Patent 11,047,023 granted on 2021-06-29Cu-Ni-Si based copper alloy sheet material and production method
#51 | 2018-09-27 β Patent 10,745,787 granted on 2020-08-18Copper alloy sheet material
#52 | 2018-09-06 β Patent 10,834,823 granted on 2020-11-10Producing metal/ceramic circuit board by removing residual silver
#53 | 2018-08-30 β Patent 11,078,587 granted on 2021-08-03Tin-plated product and method for producing same
#54 | 2018-03-22 β Patent 10,676,835 granted on 2020-06-09Tin-plated product and method for producing same
#55 | 2017-12-28 β Patent 10,501,858 granted on 2019-12-10Silver-plated product and method for producing same
#56 | 2017-05-04 β Patent 10,180,293 granted on 2019-01-15Heat radiating plate and method for producing same
#57 | 2017-03-30 β Patent 10,829,862 granted on 2020-11-10Tin-plated product and method for producing same
#58 | 2016-09-29 β Patent 10,077,502 granted on 2018-09-18Silver-plated product
#59 | 2016-09-22 β Patent 10,072,348 granted on 2018-09-11Silver-plated product
#60 | 2016-09-15 β Patent 10,597,791 granted on 2020-03-24Silver-plated product and method for producing same
#61 | 2016-07-21 β Patent 9,831,157 granted on 2017-11-28Method of attaching an electronic part to a copper plate having a surface roughness
#62 | 2016-07-14 β Patent 10,844,468 granted on 2020-11-24Copper alloy sheet material and current-carrying component
#63 | 2015-12-10 β Patent 10,199,132 granted on 2019-02-05High strength CuβNiβCoβSi based copper alloy sheet material and method for producing the same, and current carrying component
#64 | 2015-10-08 β Patent 9,944,565 granted on 2018-04-17Metal/ceramic bonding substrate and method for producing same
#65 | 2015-09-17 β Patent 9,534,307 granted on 2017-01-03Silver-plated product and method for producing same
#66 | 2015-08-27 β Patent 9,646,739 granted on 2017-05-09Method for producing silver-plated product
#67 | 2015-08-13 β Patent 9,698,554 granted on 2017-07-04Female terminal fabricating method
#68 | 2015-02-26 β Patent 9,493,859 granted on 2016-11-15Manufacturing method of copper alloy sheet
#69 | 2015-02-05 β Patent 9,905,951 granted on 2018-02-27Silver-plated product
#70 | 2014-10-30 β Patent 9,318,818 granted on 2016-04-19Electrical connector and manufacturing method thereof
#71 | 2014-10-02 β Patent 9,683,307 granted on 2017-06-20Partial plating device and partial plating method
#72 | 2014-09-25 β Patent 9,396,827 granted on 2016-07-19CuβTi based copper alloy sheet material and method for producing the same, and electric current carrying component
#73 | 2014-09-04 β Patent 9,431,737 granted on 2016-08-30Fitting type connecting terminal and method for producing same
#74 | 2014-05-29 β Patent 10,510,557 granted on 2019-12-17Electronic part mounting substrate and method for producing same
#75 | 2014-05-01 β Patent 9,412,482 granted on 2016-08-09Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same
#76 | 2014-03-27 β Patent 10,619,948 granted on 2020-04-14Heat radiating plate with supporting members and protrusion members
#77 | 2014-02-27 β Patent 9,713,253 granted on 2017-07-18Metal/ceramic bonding substrate and method for producing same
#78 | 2013-08-29 β Patent 9,356,412 granted on 2016-05-31Female terminal and method for fabricating female terminal
#79 | 2012-12-06 β Patent 9,320,129 granted on 2016-04-19Liquid-cooled integrated substrate and manufacturing method of liquid-cooled integrated substrate
#80 | 2012-11-08 β Patent 8,927,873 granted on 2015-01-06Fin-integrated substrate and manufacturing method of fin-integrated substrate
#81 | 2012-11-08 β Patent 10,174,406 granted on 2019-01-08Copper alloy plate and method for producing same
#82 | 2012-06-21 β Patent 8,745,841 granted on 2014-06-10Aluminum bonding member and method for producing same
#83 | 2012-03-01 β Patent 9,284,628 granted on 2016-03-15Copper alloy sheet and method for producing same
#84 | 2011-11-03TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
#85 | 2011-10-06 β Patent 8,992,702 granted on 2015-03-31Copper alloy sheet, manufacturing method of copper alloy sheet, and electric/electronic component
#86 | 2011-06-16 β Patent 8,262,769 granted on 2012-09-11Method of detinning Sn plating layer on Cu-based material
#87 | 2010-10-28 β Patent 9,994,933 granted on 2018-06-12Copper alloy sheet and method for producing same
#88 | 2010-06-10 β Patent 8,097,102 granted on 2012-01-17Cu-Ti-based copper alloy sheet material and method of manufacturing same
#89 | 2010-06-03 β Patent 8,871,041 granted on 2014-10-28Copper alloy plate and method for producing same
#90 | 2009-09-17METHOD FOR PRODUCING COMPOSITE PLATED PRODUCT
#91 | 2009-01-15 β Patent 8,293,039 granted on 2012-10-23Method of manufacturing copper-based alloy sheet
#92 | 2008-08-14 β Patent 9,034,123 granted on 2015-05-19CuβNiβSi-based copper alloy sheet material and method of manufacturing same
#93 | 2007-10-04 β Patent 7,926,543 granted on 2011-04-19Method for producing metal/ceramic bonding substrate
#94 | 2007-04-26 β Patent 8,039,757 granted on 2011-10-18Electronic part mounting substrate and method for producing same
#95 | 2007-01-25 β Patent 8,011,416 granted on 2011-09-06Apparatus, mold, and method for manufacturing metal-ceramic composite member
#96 | 2006-11-02 β Patent 7,487,585 granted on 2009-02-10Method of manufacturing a metal-ceramic circuit board
#97 | 2006-09-07 β Patent 7,776,426 granted on 2010-08-17Ceramic circuit substrate and manufacturing method thereof
#98 | 2006-06-29 β Patent 7,544,274 granted on 2009-06-09Plating device and plating method
#99 | 2006-03-02 β Patent 7,563,408 granted on 2009-07-21Copper alloy and method of manufacturing the same
Also check out DOWA METALTECH CO., LTD.'s (Tokyo, Japan) applicant profile with 76 patent applications submitted.
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