Suwon-Si
South Korea
29
2026-05-14
The entities that hold a legal rights for patent applications filed by inventor KIM Jin Su:
Jin Su KIM from Suwon-Si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
MULTILAYER ELECTRONIC COMPONENT
#2 | 2020-06-11Antenna module
#3 | 2020-04-23Fan-out semiconductor package
#4 | 2020-02-27Semiconductor package and antenna module including the same
#5 | 2020-01-30Semiconductor package and antenna module including the same
#6 | 2019-12-12SEMICONDUCTOR PACKAGE
#7 | 2019-12-05Semiconductor device and method for manufacturing the same
#8 | 2019-12-05Semiconductor package integrating active and passive components with electromagnetic shielding
#9 | 2019-09-19Semiconductor package
#10 | 2019-06-06Fan-out semiconductor package
#11 | 2019-05-30Fan-out semiconductor package
#12 | 2019-05-09Fan-out semiconductor package
#13 | 2019-05-02Fan-out semiconductor package module
#14 | 2019-05-02Fan-out semiconductor package
#15 | 2019-05-02FAN-OUT SEMICONDUCTOR PACKAGE
#16 | 2019-05-02Fan-out semiconductor package
#17 | 2019-05-02Fan-out semiconductor package
#18 | 2019-04-25SEMICONDUCTOR PACKAGE
#19 | 2019-04-25Semiconductor package
#20 | 2019-01-17Fan-out semiconductor package
#21 | 2019-01-10Semiconductor device and method for manufacturing the same
#22 | 2019-01-10Passivation layer having opening for under bump metallurgy
#23 | 2018-07-17Passivation layer having an opening for under bump metallurgy
#24 | 2017-02-02SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#25 | 2017-01-19Electronic device module and method of manufacturing the same
#26 | 2017-01-05LEAD FRAME AND STACK PACKAGE MODULE INCLUDING THE SAME
#27 | 2016-12-01PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#28 | 2016-10-27Semiconductor package with improved signal stability and method of manufacturing the same
#29 | 2016-05-05SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
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