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Inventor profile of:

Xinming WANG

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2015-10-08

Top Assignees for applications by Xinming WANG

The entities that hold a legal rights for patent applications filed by inventor WANG Xinming:

Ebara Corporation 12 Tokyo, Japan

Recent patent applications by WANG Xinming

Xinming WANG from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-10-08

US20150287617A1

Electricity

METHOD AND APPARATUS FOR CLEANING SUBSTRATE

#2 | 2013-04-25

US20130098397A1

Electricity

SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS

#3 | 2013-01-03

US20130000671A1

Electricity

SUBSTRATE CLEANING METHOD

#4 | 2012-12-20

US20120318304A1

Electricity

Substrate processing method and substrate processing unit

#5 | 2012-06-28

US20120160267A1

Performing operations; transporting

CLEANING METHOD AND CLEANING APPARATUS

#6 | 2011-09-01

US20110209727A1

Electricity

Method and apparatus for cleaning substrate

#7 | 2010-12-30

US20100325913A1

Mechanical engineering

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

#8 | 2010-04-29

US20100105154A1

Electricity

METHOD AND APPARATUS FOR PROCESSING SUBSTRATE

#9 | 2010-03-25

US20100075498A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND PROCESSING LIQUID

#10 | 2009-01-01

US20090000549A1

Electricity

Substrate processing method and apparatus

#11 | 2008-07-24

US20080176008A1

Electricity

Apparatus and method for forming magnetic film

#12 | 2008-06-12

US20080138508A1

Chemistry; metallurgy

Substrate Processing Method and Substrate Processing Apparatus

#13 | 2008-03-20

US20080067679A1

Electricity

Semiconductor Device and Method for Manufacturing the Same, and Processing Liquid

#14 | 2008-02-28

US20080047583A1

Electricity

Substrate Processing Method and Apparatus

#15 | 2008-02-19

US10481437

Plating apparatus and plating method

#16 | 2008-01-03

US20080000776A1

Electricity

Method and apparatus for processing substrate

#17 | 2007-11-20

US10481448

Plating apparatus

#18 | 2007-10-04

US20070228569A1

Electricity

Interconnects forming method and interconnects forming apparatus

#19 | 2007-09-27

US20070224811A1

Electricity

Substrate processing method and substrate processing apparatus

#20 | 2007-02-06

US10481424

Substrate processing apparatus and method

#21 | 2006-11-28

US10482117

Substrate processing apparatus and method

#22 | 2006-03-16

US20060057839A1

Electricity

Method and apparatus for forming metal film

#23 | 2005-11-03

US20050245080A1

Electricity

Method for processing substrate

#24 | 2005-09-22

US20050208774A1

Electricity

Wet processing method and processing apparatus of substrate

#25 | 2005-03-24

US20050064702A1

Electricity

Interconnects forming method and interconnects forming apparatus

#26 | 2005-02-03

US20050022909A1

Chemistry; metallurgy

Substrate processing method and substrate processing apparatus

#27 | 2005-01-13

US20050009340A1

Electricity

Method and apparatus for forming capping film

#28 | 2005-01-13

US20050009213A1

Electricity

Substrate processing method

InventorID:

1519 ⎘