Arnoldstein
Austria
16
2023-08-31
The entities that hold a legal rights for patent applications filed by inventor Krivec Stefan:
Stefan Krivec from Arnoldstein, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
CHIP ARRANGEMENT, CHIP PACKAGE, METHOD OF FORMING A CHIP ARRANGEMENT, AND METHOD OF FORMING A CHIP PACKAGE
#2 | 2022-03-24Semiconductor device and method for forming a semiconductor device
#3 | 2019-12-19Methods of forming a silicon-insulator layer and semiconductor device having the same
#4 | 2019-11-28Electrical contact connection on silicon carbide substrate
#5 | 2019-10-10Semiconductor device and method for forming a semiconductor device
#6 | 2019-05-09Semiconductor device with non-ohmic contact between SiC and a contact layer containing metal nitride
#7 | 2018-06-07Methods for manufacturing a semiconductor device having a non-ohmic contact formed between a semiconductor material and an electrically conductive contact layer
#8 | 2018-02-22Semiconductor component, method for processing a substrate and method for producing a semiconductor component
#9 | 2017-07-06Method of manufacturing a layer structure having partially sealed pores
#10 | 2017-06-15Semiconductor wafer and method
#11 | 2017-04-11Method of manufacturing an electronic device having a contact pad with partially sealed pores
#12 | 2016-09-22Method for manufacturing a semiconductor device having a Schottky contact
#13 | 2016-07-21Method for Processing a Semiconductor Surface
#14 | 2016-06-23Semiconductor Device and Method for Manufacturing a Semiconductor Device
#15 | 2016-05-19Apparatus for analyzing ion kinetics in dielectrics
#16 | 2016-05-05SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
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