Shigeya Kurimura

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-10-30

Top Assignees for applications by Shigeya Kurimura

The entities that hold a legal rights for patent applications filed by inventor Kurimura Shigeya:

Shigeya Kurimura from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

METHOD FOR MANUFACTURING PACKAGED DEVICE CHIPS

Package substrate dividing method

InventorID:

1543395 ⎘