Chandler, Arizona
United States
29
2024-08-29
The entities that hold a legal rights for patent applications filed by inventor Baloglu Bora:
Bora Baloglu from Chandler, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF
#2 | 2024-03-14METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
#3 | 2023-01-05SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4 | 2022-02-17Method of manufacturing an electronic device and electronic device manufactured thereby
#5 | 2021-09-09Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#6 | 2021-08-19Semiconductor device with integrated heat distribution and manufacturing method thereof
#7 | 2021-07-15ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATING METHOD THEREOF
#8 | 2020-08-06Method of manufacturing an electronic device and electronic device manufactured thereby
#9 | 2020-06-11Semiconductor device and manufacturing method thereof
#10 | 2020-01-16Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#11 | 2020-01-02Semiconductor device with integrated heat distribution and manufacturing method thereof
#12 | 2019-10-03Electronic device with adaptive vertical interconnect and fabricating method thereof
#13 | 2019-06-20Semiconductor device with integrated heat distribution and manufacturing method thereof
#14 | 2018-12-27Embedded vibration management system having an array of vibration absorbing structures
#15 | 2018-11-20Stress relieving through-silicon vias
#16 | 2018-07-24Embedded vibration management system
#17 | 2018-07-05Method of manufacturing an electronic device and electronic device manufactured thereby
#18 | 2018-03-22Encapsulated semiconductor package and method of manufacturing thereof
#19 | 2018-03-01Method of manufacturing an electronic device and electronic device manufactured thereby
#20 | 2017-12-07Semiconductor device and manufacturing method thereof
#21 | 2017-07-06Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#22 | 2017-05-18Encapsulated semiconductor package and method of manufacturing thereof
#23 | 2017-03-28Stress relieving through-silicon vias
#24 | 2017-01-31Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#25 | 2016-06-16Molded Electronic Package Geometry To Control Warpage And Die Stress
#26 | 2016-05-24Electronic package with embedded materials in a molded structure to control warpage and stress
#27 | 2016-02-23Molded electronic package geometry to control warpage and die stress
#28 | 2015-03-24Warpage control stiffener ring package and fabrication method
#29 | 2015-01-27Die seal design and method and apparatus for integrated circuit production
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