Bhaskar Kumar

Stress treatments for cover wafers

CARBON CVD DEPOSITION METHODS TO MITIGATE STRESS INDUCED DEFECTS

Method of using dual frequency RF power in a process chamber

Remote Capacitively Coupled Plasma Source with Improved Ion Blocker

Techniques to improve adhesion and defects for tungsten carbide film

Plasma density control on substrate edge

Plasma parameters and skew characterization by high speed imaging

Apparatus and methods for removing contaminant particles in a plasma process

Chucking process and system for substrate processing chambers

Remote capacitively coupled plasma source with improved ion blocker

Apparatus and methods for removing contaminant particles in a plasma process

Plasma density control on substrate edge

GAS PHASE PARTICLE REDUCTION IN PECVD CHAMBER

Selective poreseal deposition prevention and residue removal using SAM

Plasma parameters and skew characterization by high speed imaging

Technique to prevent aluminum fluoride build up on the heater

Aluminum fluoride mitigation by plasma treatment

Interconnect integration for sidewall pore seal and via cleanliness

Gallium arsenide based materials used in thin film transistor applications

Aluminum nitride barrier layer

SELECTIVE SEALANT REMOVAL

Thin film encapsulation-thin ultra high barrier layer for OLED application

GALLIUM ARSENIDE BASED MATERIALS USED IN THIN FILM TRANSISTOR APPLICATIONS

High efficiency thin film transistor device with gallium arsenide layer

APPARATUS AND METHODS FOR REDUCING LIGHT INDUCED DAMAGE IN THIN FILM SOLAR CELLS

High quality TCO-silicon interface contact structure for high efficiency thin film silicon solar cells