Lancaster, Massachusetts
United States
13
2023-06-01
The entities that hold a legal rights for patent applications filed by inventor Halleck William R.:
William R. Halleck from Lancaster, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Multiple dies hardware processors and methods
#2 | 2022-02-17Multiple dies hardware processors and methods
#3 | 2021-06-17Bimodal PHY for low latency in high speed interconnects
#4 | 2020-10-22Multiple dies hardware processors and methods
#5 | 2020-09-17Bimodal PHY for low latency in high speed interconnects
#6 | 2019-10-10Bimodal phy for low latency in high speed interconnects
#7 | 2018-07-05High speed interconnect with channel extension
#8 | 2018-06-28Bimodal PHY for low latency in high speed interconnects
#9 | 2018-04-12Multiple dies hardware processors and methods
#10 | 2018-04-05Link-physical layer interface adapter
#11 | 2017-04-20High performance interconnect link state transitions
#12 | 2016-06-23High performance interconnect
#13 | 2016-06-23High performance interconnect link state transitions
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