Villach
Austria
33
2025-08-07
The entities that hold a legal rights for patent applications filed by inventor Moder Iris:
Iris Moder from Villach, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
Apparatus for Electrochemical Treating of a Semiconductor Substrate and a Process using the Apparatus
#2 | 2025-07-24METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A WIDE BAND GAP SEMICONDUCTOR BODY
#3 | 2025-06-05METHOD OF PROCESSING A SEMICONDUCTOR WAFER
#4 | 2024-05-09SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#5 | 2023-08-31SEMICONDUCTOR SUBSTRATE HAVING AN ALIGNMENT STRUCTURE
#6 | 2023-04-27Manufacturing and reuse of semiconductor substrates
#7 | 2022-11-10Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
#8 | 2022-09-29Method of porosifying part of a semiconductor wafer
#9 | 2022-08-04Silicon Carbide Devices, Semiconductor Devices and Methods for Forming Silicon Carbide Devices and Semiconductor Devices
#10 | 2021-12-16METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND SEMICONDUCTOR SUBSTRATE HAVING A DEVICE LAYER OF HIGH EVENNESS
#11 | 2021-12-16SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING
#12 | 2021-08-26Semiconductor device having semiconductor device elements in a semiconductor layer
#13 | 2020-11-19Semiconductor surface smoothing and semiconductor arrangement
#14 | 2020-09-10Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
#15 | 2020-06-04Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices
#16 | 2020-05-28Method for partially removing a semiconductor wafer
#17 | 2020-03-26Devices with backside metal structures and methods of formation thereof
#18 | 2019-11-14Semiconductor device and manufacturing method
#19 | 2019-03-07Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing
#20 | 2018-12-27Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
#21 | 2018-11-15Method for Thinning Substrates
#22 | 2018-09-27Method for manufacturing a semiconductor device comprising etching a semiconductor material
#23 | 2018-09-20Reticle and exposure method including projection of a reticle pattern into neighboring exposure fields
#24 | 2018-08-16Devices with backside metal structures and methods of formation thereof
#25 | 2018-05-24SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES
#26 | 2018-05-24Method of wafer thinning and realizing backside metal structures
#27 | 2018-02-08Devices with backside metal structures and methods of formation thereof
#28 | 2017-11-23Semiconductor device and methods for forming a plurality of semiconductor devices
#29 | 2017-06-01Substrates with buried isolation layers and methods of formation thereof
#30 | 2017-05-25Method for thinning substrates
#31 | 2017-05-11Method of forming a semiconductor device and semiconductor device
#32 | 2017-02-02MICROFILTRATION DEVICE
#33 | 2016-07-14Semiconductor arrangement including buried anodic oxide and manufacturing method
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