Endicott, New York
United States
25
2017-05-25
The entities that hold a legal rights for patent applications filed by inventor Powell Douglas O.:
Douglas O. Powell from Endicott, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Reduced-warpage laminate structure
#2 | 2016-06-02Reduced-warpage laminate structure
#3 | 2016-06-02Reduced-warpage laminate structure
#4 | 2016-03-17Sacrificial carrier dicing of semiconductor wafers
#5 | 2016-03-17Sacrificial carrier dicing of semiconductor wafers
#6 | 2014-01-30Elastic modulus mapping of a chip carrier in a flip chip package
#7 | 2013-03-28Reducing impedance discontinuity in packages
#8 | 2012-11-29Construction of reliable stacked via in electronic substrates—vertical stiffness control method
#9 | 2012-11-08Clustered stacked vias for reliable electronic substrates
#10 | 2012-10-25Construction of reliable stacked via in electronic substrates—vertical stiffness control method
#11 | 2010-09-02MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC
#12 | 2009-10-22Organic Substrate with Asymmetric Thickness for Warp Mitigation
#13 | 2009-07-30Clustered stacked vias for reliable electronic substrates
#14 | 2009-07-30EMBEDDED CONSTRAINER DISCS FOR RELIABLE STACKED VIAS IN ELECTRONIC SUBSTRATES
#15 | 2009-07-30Construction of reliable stacked via in electronic substrates—vertical stiffness control method
#16 | 2009-05-21Method and apparatus to reduce impedance discontinuity in packages
#17 | 2008-11-27Apparatus for crack prevention in integrated circuit packages
#18 | 2008-09-11Multi-layered interconnect structure using liquid crystalline polymer dielectric
#19 | 2008-07-31Multi-layered interconnect structure using liquid crystalline polymer dielectric
#20 | 2006-10-31Z-interconnections with liquid crystal polymer dielectric films
#21 | 2006-08-01Joining member for Z-interconnect in electronic devices without conductive paste
#22 | 2005-08-23Organic dielectric electronic interconnect structures and method for making
#23 | 2005-07-14Organic dielectric electronic interconnect structures and method for making
#24 | 2005-03-17Multi-layered interconnect structure using liquid crystalline polymer dielectric
#25 | 2005-01-13Method and structure for small pitch z-axis electrical interconnections
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