Daniel Bolowski

City:

Warstein-Suttrop

Country:

Germany

Published Applications:

Last publication date:

2013-03-28

Top Assignees for applications by Daniel Bolowski

The entities that hold a legal rights for patent applications filed by inventor Bolowski Daniel:

INFINEON TECHNOLOGIES AG 1 Neubiberg, Germany

Recent patent applications by Bolowski Daniel

Daniel Bolowski from Warstein-Suttrop, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-03-28

US20130075932A1

Electricity

Power semiconductor module with integrated thick-film printed circuit board

InventorID:

161093 ⎘