Durham, North Carolina
United States
77
2026-03-05
The entities that hold a legal rights for patent applications filed by inventor Andrews Peter Scott:
Peter Scott Andrews from Durham, US has applied for patents for these inventions. The list has both pending applications and granted patents:
DIE ATTACH STRUCTURES FOR LIGHT-EMITTING DIODE CHIPS ON LEAD FRAMES
#2 | 2025-07-10LED CHIPS AND DEVICES WITH TEXTURED LIGHT-EXTRACTING PORTIONS, AND FABRICATION METHODS
#3 | 2025-02-13SOLID STATE LIGHT EMITTING COMPONENTS WITH UNITARY LENS STRUCTURES
#4 | 2024-07-11SIDEWALL ARRANGEMENTS FOR LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS
#5 | 2024-02-15LIGHT EMITTING DEVICE WITH LIGHT-ALTERING MATERIAL LAYER, AND FABRICATION METHOD UTILIZING SEALING TEMPLATE
#6 | 2022-08-25High density pixelated LED and devices and methods thereof
#7 | 2022-08-11OPTICAL ARRANGEMENTS IN COVER STRUCTURES FOR LIGHT EMITTING DIODE PACKAGES AND RELATED METHODS
#8 | 2022-06-23LED chips and devices with textured light-extracting portions, and fabrication methods
#9 | 2022-04-28Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods
#10 | 2021-12-30LED chips with irregular microtextured light extraction surfaces, and fabrication methods
#11 | 2021-06-03Pixelated-LED chips and chip array devices, and fabrication methods
#12 | 2021-04-29Texturing for high density pixelated-LED chips and chip array devices
#13 | 2021-04-22Light emitting diodes, components and related methods
#14 | 2021-03-11High density pixelated LED and devices and methods thereof
#15 | 2021-01-07Light-emitting diode package with light-altering material
#16 | 2020-12-31Solid-state light emitting devices including light emitting diodes in package structures
#17 | 2020-12-31High density pixelated-LED chips and chip array devices
#18 | 2020-12-17Pixelated-LED chips and chip array devices, and fabrication methods
#19 | 2020-10-01Solid state lighting components
#20 | 2020-06-25Pixelated-LED chips and chip array devices, and fabrication methods
#21 | 2020-06-18Light emitting diodes, components and related methods
#22 | 2020-06-18Apparatus and methods for mass transfer of electronic die
#23 | 2020-04-02Light-emitting diode package with light-altering material
#24 | 2019-10-31Apparatus and methods for mass transfer of electronic die
#25 | 2019-10-24Light-emitting diode package with light-altering material
#26 | 2019-10-22LED apparatuses and methods
#27 | 2019-09-05High density pixelated LED and devices and methods thereof
#28 | 2019-08-15Solid state lighting devices with opposing emission directions
#29 | 2019-08-01Light emitting diodes, components and related methods
#30 | 2019-03-07Light emitting diodes, components and related methods
#31 | 2019-03-07High density pixelated-LED chips and chip array devices
#32 | 2019-02-07High density pixelated-led chips and chip array devices
#33 | 2018-02-01Light emitting diodes, components and related methods
#34 | 2017-11-30Substrate based light emitter devices, components, and related methods
#35 | 2017-10-12High density pixelated LED and devices and methods thereof
#36 | 2017-10-12High density pixelated LED and devices and methods thereof
#37 | 2017-04-06Low optical loss flip chip solid state lighting device
#38 | 2016-11-03Solid state lighting components
#39 | 2016-09-20Surface mount device with stress mitigation measures
#40 | 2016-01-14LIGHT EMITTER DEVICES AND METHODS FOR LIGHT EMITTING DIODE (LED) CHIPS
#41 | 2015-06-25LIGHT EMITTER COMPONENTS AND METHODS HAVING IMPROVED PERFORMANCE
#42 | 2015-02-19HIGH DENSITY MULTI-CHIP LED DEVICES
#43 | 2014-09-25POWER SURFACE MOUNT LIGHT EMITTING DIE PACKAGE
#44 | 2014-09-18Light emitter components, systems, and related methods
#45 | 2014-08-28High voltage array light emitting diode (LED) devices and fixtures
#46 | 2014-08-28Light emitter components and methods having improved performance
#47 | 2014-08-28Light emitter packages and methods
#48 | 2014-08-07Light emitter devices
#49 | 2014-07-03Light emitting devices for light emitting diodes (LEDs)
#50 | 2014-07-03LED PACKAGE WITH FLEXIBLE POLYIMIDE CIRCUIT AND METHOD OF MANUFACTURING LED PACKAGE
#51 | 2014-04-10Light emitting devices for light emitting diodes (LEDs)
#52 | 2014-03-13WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
#53 | 2013-10-03Ceramic-based light emitting diode (LED) devices, components and methods
#54 | 2013-10-03Substrate based light emitter devices, components, and related methods
#55 | 2013-08-01Submount based surface mount device (SMD) light emitter components and methods
#56 | 2013-08-01Light emitter packages and devices having improved wire bonding and related methods
#57 | 2013-06-27Light emitter devices and components with improved chemical resistance and related methods
#58 | 2013-05-16Light emitting diode (LED) packages and related methods
#59 | 2013-04-18Multi-die LED package
#60 | 2013-03-28High voltage array light emitting diode (LED) devices and fixtures
#61 | 2012-10-04Attachment devices and methods for light emitting devices
#62 | 2012-09-20Power surface mount light emitting die package
#63 | 2012-09-06Remote component devices, systems, and methods for use with light emitting devices
#64 | 2012-08-02Reflective mounting substrates for flip-chip mounted horizontal LEDs
#65 | 2012-05-24Light emitting devices
#66 | 2012-05-24Light emitting devices for light emitting diodes (LEDs)
#67 | 2012-03-22Multi-chip LED devices
#68 | 2012-03-22High density multi-chip LED devices
#69 | 2011-10-13HEAT DISSIPATION SYSTEM FOR ELECTRICAL COMPONENTS
#70 | 2011-09-15High CRI lighting device with added long-wavelength blue color
#71 | 2011-09-15High CRI lighting device with added long-wavelength blue color
#72 | 2011-05-26Power surface mount light emitting die package
#73 | 2010-12-23Heat Dissipation Packaging for Electrical Components
#74 | 2009-12-24Methods of assembly for a semiconductor light emitting device package
#75 | 2009-02-12SEMICONDUCTOR LIGHT EMITTING DEVICES WITH SEPARATED WAVELENGTH CONVERSION MATERIALS AND METHODS OF FORMING THE SAME
#76 | 2008-03-06Light emitting device packages, light emitting diode (LED) packages and related methods
#77 | 2007-08-30Power surface mount light emitting die package
163443 ⎘