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Lens arrays in light-emitting diode packages

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PSEUDO-EXPONENTIAL ENCODING FOR LIGHT-EMITTING DEVICES AND RELATED METHODS

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LIGHT-EMITTING DIODE PACKAGES WITH VARYING CURRENT PULSE WIDTH MODULATION AND RELATED METHODS

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THREE DIMENSIONAL LED DEVICE AND METHOD OF MANUFACTURE

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LIGHT-EMITTING DIODE PACKAGES FOR ENVIRONMENTAL INDICATION

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ACTIVE CONTROL OF LIGHT EMITTING DIODES AND LIGHT EMITTING DIODE DISPLAYS

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LIGHT-EMITTING DIODE PACKAGES WITH TRANSFORMATION AND SHIFTING OF PULSE WIDTH MODULATION SIGNALS AND RELATED METHODS

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Light-emitting diodes as shunt regulator to power low-voltage circuits

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LIGHT-EMITTING DIODES WITH MIXED CLOCK DOMAIN SIGNALING

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Asymmetric LED optic for asymmetric luminaire applications

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Light-emitting diode packages with transformation and shifting of pulse width modulation signals and related methods

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ERROR DETECTION IN LED PACKAGES

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LIQUID METAL ALLOYS IN A LIGHT-EMITTING DIODE DEVICE

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SEALING STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES

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INTERCONNECT STRUCTURES FOR IMPROVED LIGHT-EMITTING DIODE CHIP PERFORMANCE

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CONTACT STRUCTURES IN LIGHT-EMITTING DIODE CHIPS FOR REDUCED VOIDING OF BONDING METALS

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LIGHT-EMITTING DIODE PACKAGES WITH LEAD FRAME STRUCTURES FOR FLIP-CHIP MOUNTING OF LIGHT-EMITTING DIODE CHIPS

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LIGHT-EMITTING DIODE CHIP STRUCTURES WITH ELECTRICALLY INSULATING SUBSTRATES AND RELATED METHODS

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EMISSION HEIGHT ARRANGEMENTS IN LIGHT-EMITTING DIODE PACKAGES AND RELATED DEVICES AND METHODS

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LIGHT-EMITTING DIODE PACKAGES WITH DIRECTIONAL EMISSION INTENSITY AND COLOR UNIFORMITY

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ACTIVE CONTROL OF LIGHT EMITTING DIODES AND LIGHT EMITTING DIODE DISPLAYS

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CONTACT STRUCTURES OF LED CHIPS FOR CURRENT INJECTION

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ARRANGEMENTS OF MULTIPLE-CHIP LIGHT-EMITTING DIODE PACKAGES

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Light-emitting diodes with mixed clock domain signaling

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High voltage monolithic LED chip with improved reliability

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Polarization structures for light-emitting diodes

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RGB LED package with BSY emitter

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Integration of secondary optics into chip covers for improved optical emission of high intensity light-emitting diodes

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Broad electromagnetic spectrum light-emitting diode packages

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Integrated warning structures for energized ultraviolet light-emitting diode packages

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Localized surface plasmon resonance for enhanced photoluminescence of lumiphoric materials

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COVER STRUCTURE ARRANGEMENTS FOR LIGHT EMITTING DIODE PACKAGES

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Edge structures for light shaping in light-emitting diode chips

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Human necessities

Light-emitting devices for horticulture applications

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Reflective layers for light-emitting diodes

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Arrangements for light emitting diode packages

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High density pixelated LED and devices and methods thereof

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Solid-state light emitting device with improved color emission

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Interconnects for light emitting diode chips

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LED chips and devices with textured light-extracting portions, and fabrication methods

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Support structures for light emitting diode packages

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Multi-segment monolithic LED chip

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Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods

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Spacer layer arrangements for light-emitting diodes

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Binder materials for light-emitting devices

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Light-altering particle arrangements for light-emitting devices

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Lens arrangements for light-emitting diode packages

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LED chips with irregular microtextured light extraction surfaces, and fabrication methods

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Active electrical elements with light-emitting diodes

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Multi-layer conversion material for down conversion in solid state lighting

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Group III nitride based LED structures including multiple quantum wells with barrier-well unit interface layers

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Light-emitting diode chip with electrical overstress protection

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Lumiphoric arrangements for light emitting diode packages

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Light-altering material arrangements for light-emitting devices

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REFLECTIVE LAYERS FOR LIGHT-EMITTING DIODES

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Light-emitting diode packages

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LED package with multiple element light source and encapsulant having curved and/or planar surfaces

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Contact structures for light emitting diode chips

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Pixelated-LED chips and chip array devices, and fabrication methods

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Submount structures for light emitting diode packages

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Light emitting diode package and method for fabricating same

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Texturing for high density pixelated-LED chips and chip array devices

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Light emitting diodes, components and related methods

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Wafer level packaging of light emitting diodes (LEDs)

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High density pixelated LED and devices and methods thereof

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Tunable integrated optics LED components and methods

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High density pixelated-LED chips and chip array devices

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Active control of light emitting diodes and light emitting diode displays

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Active control of light emitting diodes and light emitting diode displays

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