Tainan
Taiwan
63
2026-06-25
The entities that hold a legal rights for patent applications filed by inventor LI Ching-I:
Ching-I LI from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
ENHANCED TRENCH ISOLATION STRUCTURE
#2 | 2026-06-18METHODS FOR MANUFACTURING SEMICONDUCTOR PLUG STRUCTURE AND SEMICONDUCTOR STRUCTURE HAVING THE SEMICONDUCTOR PLUG STRUCTURE
#3 | 2026-04-09MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
#4 | 2025-11-27PRE-CLEANING FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
#5 | 2025-11-27MULTILAYER ISOLATION STRUCTURE FOR HIGH VOLTAGE SILICON-ON-INSULATOR DEVICE
#6 | 2025-11-20PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
#7 | 2025-11-06IMPROVED FULL WELL CAPACITY FOR IMAGE SENSOR
#8 | 2025-10-30DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR NARROWED BY EPITAXY GROWTH
#9 | 2025-10-23PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR
#10 | 2025-10-23DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
#11 | 2025-10-09PHOTODIODE STRUCTURE FOR IMAGE SENSOR
#12 | 2025-10-02HYBRID BULK SEMICONDUCTOR AND SEMICONDUCTOR ON INSULATOR (SOI) SUBSTRATE AND METHODS OF FORMATION
#13 | 2025-09-04IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
#14 | 2025-07-31SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
#15 | 2025-07-17MULTI-LAYER ALIGNMENT MARK STRUCTURE
#16 | 2025-05-15PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
#17 | 2025-05-01METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
#18 | 2024-11-21METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
#19 | 2024-11-14BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
#20 | 2024-11-14IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
#21 | 2024-11-14ION IMPLANTATION SYSTEM
#22 | 2024-11-07ISOLATION EPITAXIAL BI-LAYER FOR BACKSIDE DEEP TRENCH ISOLATION STRUCTURE IN AN IMAGE SENSOR
#23 | 2024-10-24DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR NARROWED BY EPITAXY GROWTH
#24 | 2024-06-06Photolithography alignment process for bonded wafers
#25 | 2024-02-29PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR
#26 | 2024-01-25TRAPPING LAYER FOR A RADIO FREQUENCY DIE AND METHODS OF FORMATION
#27 | 2024-01-18ENHANCED TRENCH ISOLATION STRUCTURE
#28 | 2023-12-21LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE SENSORS
#29 | 2023-12-14DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
#30 | 2023-11-30Semiconductor structure and method for forming the same
#31 | 2023-11-23PHOTODIODE STRUCTURE FOR IMAGE SENSOR
#32 | 2023-11-23PRE-CLEANING FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
#33 | 2023-11-23SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME
#34 | 2023-11-16PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
#35 | 2023-11-16Ion implantation system
#36 | 2023-11-09METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
#37 | 2023-10-26FULL WELL CAPACITY FOR IMAGE SENSOR
#38 | 2023-10-12MULTILAYER ISOLATION STRUCTURE FOR HIGH VOLTAGE SILICON-ON-INSULATOR DEVICE
#39 | 2023-09-07MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS
#40 | 2023-03-02Mechanical wafer alignment detection for bonding process
#41 | 2023-02-02IMAGE SENSOR WITH DIFFUSION BARRIER STRUCTURE
#42 | 2022-12-01BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
#43 | 2022-11-17Light absorbing layer to enhance P-type diffusion for DTI in image sensors
#44 | 2022-10-13Photolithography alignment process for bonded wafers
#45 | 2022-09-15Isolation epitaxial bi-layer for backside deep trench isolation structure in an image sensor
#46 | 2022-05-05P-type field effect transistor and method for fabricating the same
#47 | 2020-07-23P-type field effect transistor having channel region with top portion and bottom portion
#48 | 2020-05-07Method for fabricating semiconductor device
#49 | 2019-07-25Method of forming FinFET device
#50 | 2019-07-11P-type field effect transistor and method for fabricating the same
#51 | 2019-04-16FinFET device and method of forming the same
#52 | 2018-04-19Method for manufacturing fins
#53 | 2018-01-02Method for manufacturing fins
#54 | 2016-10-06Forming punch-through stopper regions in finFET devices
#55 | 2016-05-12Method for ion implantation
#56 | 2015-12-24Lower dose rate ion implantation using a wider ion beam
#57 | 2014-10-30Methods for using isotopically enriched levels of dopant gas compositions in an ion implantation process
#58 | 2013-08-08Semiconductor process
#59 | 2013-05-30Semiconductor process
#60 | 2013-01-31Semiconductor device and manufacturing method thereof
#61 | 2013-01-24Manufacturing method for metal gate
#62 | 2012-04-05Method of fabricating an NMOS transistor
#63 | 2011-06-30Method for fabricating metal-oxide semiconductor transistors
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